Tokyo Electron Limited

Shu Yamamoto

Yuichi Douki

Terufumi Wakiyama

Satoshi Okamura

Masataka Gosho

Tomohito Ura

Akinori Tanaka

Minoru Tashiro

Reo Kitayama

A substrate processing apparatus for drying a substrate by substituting a liquid film of a drying liquid formed on the substrate with a supercritical fluid incudes: a pressure container configured to accommodate the substrate on which the liquid film is formed; a discharge line configured to discharge a fluid inside the pressure container; a depressurizing valve provided in a middle of the discharge line; and a concentration measurement part configured to measure a concentration of vapor of the drying liquid in the fluid flowing through the discharge line, wherein the concentration measurement part is provided on a downstream side of the depressurizing valve of the discharge line and measures the concentration of the drying liquid in the fluid depressurized by the depressurizing valve.

Substrate processing apparatus and substrate processing method

A controller is configured to control a liquid supply to change a landing position of a liquid on a surface of a substrate continuously by discharging the liquid toward the surface of the substrate from a first liquid discharge nozzle while moving the first liquid discharge nozzle. The controller is also configured to derive discharge position deviation information of the liquid supply by comparing first temperature information based on a spot temperature measured by a temperature measurement device when the first liquid discharge nozzle is moved along a first nozzle path and second temperature information based on the spot temperature measured by the temperature measurement device when the first liquid discharge nozzle is moved along a second nozzle path which is different from the first nozzle path.

Substrate liquid processing apparatus and liquid discharge evaluation method

A process-liquid supply part includes: a supply tank configured to contain a process liquid; a level gauge pipe connected to the supply tank, the level gauge pipe being provided with level sensors for detecting a remaining amount of the process liquid contained in the supply tank; and a measuring part configured to measure a remaining amount of the process liquid based on signals from the level sensors provided on the level gauge pipe. Connected to the supply tank are a process-liquid supply pipe configured to drain the process liquid contained in the supply tank, and a process-liquid return pipe configured to introduce the process liquid drained through the process-liquid supply pipe to the supply tank. A connection pipe, in which an openable and closable valve is provided, disposed between the process-liquid supply pipe or the process-liquid return pipe and the level gauge pipe.

Process-liquid supply mechanism and process-liquid supply method

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Kumamoto, Japan

Shu Yamamoto