Taiwan Semiconductor Manufacturing Comp. Ltd.

Shu-Fang Chen

Hung-Chang Hsieh

Tai-Yuan Wang

Hung-Chung Chien

Jhun Hua Chen

Lin-Hung Shiu

A method of forming a semiconductor device includes forming a first semiconductor strip protruding above a first region of a substrate and a second semiconductor strip protruding above a second region of the substrate, forming an isolation region between the first semiconductor strip and the second semiconductor strip, forming a gate stack over and along sidewalls of the first semiconductor strip and the second semiconductor strip, etching a trench extending into the gate stack and isolation regions, the trench exposing the first region of the substrate and the second region of the substrate, forming a dielectric layer on sidewalls and a bottom surface of the trench and filling a conductive material over the dielectric layer and in the trench to form a contact, where the contact extends below a bottommost surface of the isolation region.

Shallow trench isolation (STI) contact structures and methods of forming same

A lithography method is provided in accordance with some embodiments. The lithography method includes forming a surface modification layer on a substrate, the surface modification layer including a hydrophilic top surface; coating a photoresist layer on the surface modification layer; and developing the photoresist layer, thereby forming a patterned photoresist layer.

Lithography method with surface modification layer

The present disclosure provides a semiconductor fabrication method. The method includes modifying an edge portion of a wafer such that the edge portion are prevented from resist coating; coating a resist layer on the front surface of the wafer, wherein the resist layer is free from the edge portion of the wafer; and performing an exposing process to the resist layer.

Growing community of inventors

Hsinchu County, Taiwan

Shu-Fang Chen