Entegris, Inc.

Shrane Ning Jenq

Peng Zhang

Jeffrey A Barnes

Jun Liu

Laisheng Sun

Steven Medd

A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of alkali hydroxides, alkaline earth metal hydroxides, and tetramethylammonium hydroxide. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.

Growing community of inventors

Hsinchu County, Taiwan

Shrane Ning Jenq