Tokyo Ohka Kogyo Co., Ltd.

Basf Aktiengesellschaft

Shozo Miyazawa

Hisashi Nakane

Akira Yokota

Wataru Ishii

Shinji Tsuchiya

The improved water-soluble photosensitive resin composition comprises a high-polymer compound represented by the general formula(I): ##STR1## (where X is Na, K or NH.sub.4) and a water-soluble polymer which is either polyvinylpyrrolidone or a copolymer of vinylpyrrolidone and vinylimidazole or both. The composition is applied to a substrate, exposed through a mask pattern and developed to form a photocured pattern and, thereafter, a light absorber is applied to the entire surface of the substrate and dried, followed by stripping away the photocured pattern and the overlying light absorber to form a black matrix pattern. The composition is suitable for use as a photoresist in the manufacture of black matrices as on color CRTs and capable of efficient formation of photocured patterns with high sensitivity by shorter times and lower intensities of exposure. In addition, the composition adheres strongly to glass substrates and is capable of pattern formation as thin film that is faithful to the mask pattern used.

Water-soluble photosensitive resin composition and a method of forming

The undercoating composition of the invention, useful for providing an undercoating layer for a top coat of a photosensitive resist layer on a substrate surface, comprises, as a principal ingredient thereof, a condensation product obtained by the condensation reaction between a hydroxy-substituted diphenylamine and a melamine compound substituted on the nitrogen atoms with methylol groups and/or alkoxymethyl groups. The undercoating obtained of the composition is highly resistant against the attack by the overcoating solution applied thereon so that the fidelity of the pattern reproduction by the photolithographic technique is greatly improved by virtue of the absence of any disorder at the interface between the undercoating and top coat layers. The advantage is further increased when the undercoating composition further comprises a photoextinctive agent, e.g. a dye, having absorptivity in the wave length region where the photosensitive resist of the top coat has sensitivity.

Undercoating material for photosensitive resins

Method of preparing photoresist material with undercoating of

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Chigasaki, Japan

Shozo Miyazawa