Anji Microelectronics (shanghai) Co., Ltd.

Anji Microelectronics Technology (shanghai) Co., Ltd.

Shoutian Li

Xiaoming Ren

Changzheng Jia

Disclosed is a chemical mechanical polishing solution, which contains water, cerium oxide, polyquatemium, carboxylic acid containing a benzene ring and polyvinylamine. The function of auto stop in its true sense can only be achieved by using polyquatemium, carboxylic acid containing a benzene ring and polyvinylamine together. On the blanks, the polishing rates are low, while at the high step heights of patterned silicon chips, high polishing rates are kept. The lower is the step height, the better is the polishing rate inhibited, and thus the function of auto stop is achieved.

Chemical-mechanical polishing liquid

Disclosed is a chemical mechanical polishing solution containing water, cerium oxide abrasive particles and hydroxylamine, which can also increase the removal rate of patterned silicon dioxide with further addition of 4-hydroxybenzoic acid or salicylhydroxamic acid.

Chemical mechanical polishing solution

Disclosed is a chemical mechanical polishing solution containing water, cerium oxide, polyacrylic acid and polyether amine. The chemical mechanical polishing solution in this application uses polyether amine as an additive, which can improve the polishing rate of silicon dioxide by negatively charged cerium oxide.

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Shanghai, China

Shoutian Li