Ricoh Company, Ltd.

Shouji Tochishita

Kenji Nishihara

Tohru Haruki

Koichi Sogawa

Tadao Uehara

Hidetsugu Miyake

Kiyotaka Ishibushi

Minoru Ohtomo

Kiyoshi Yano

A method of manufacturing a semiconductor device is disclosed that includes a semiconductor wafer having a main surface including a device chip area, a peripheral area encompassing the device chip area, and a blank area situated between the device chip area and the peripheral area. The method includes the steps of coating the entire main surface of the semiconductor wafer with a positive photosensitive resist, defining an additional exposure area in the blank area, conducting a first exposure process on the peripheral area and the additional exposure area, conducting a second exposure process on the device chip area, removing resist remaining on predetermined areas of the device chip area, the peripheral area and the blank area after conducting the first and second exposure processes for forming a resist pattern, and dry-etching the main surface of the semiconductor wafer by using the resist pattern as a mask.

Method of manufacturing semiconductor device

A semiconductor wafer is disclosed that includes a substrate; a plurality of device chip areas formed on the substrate; a plurality of scribe lines formed in a lattice-like manner on the substrate, the scribe lines being provided so as to separate the device chip areas from each other; a blank area in which at least one alignment mark formed of a metal film for alignment of the semiconductor wafer is formed, the blank area being provided in an area different from the device chip areas; and a scribe area in which the alignment mark is prevented from existing, the scribe area being provided in each area where the blank area crosses the scribe lines.

Wafer, reticle, and exposure method using the wafer and reticle

Growing community of inventors

Hyogo, Japan

Shouji Tochishita