Sanyo Electric Co., Ltd.

Shoichiro Nakayama

Shigeru Noguchi

Keiichi Sano

Hiroshi Iwata

Satoshi Ishida

Hiroyuki Kuriyama

Yukinori Kuwano

Shoichi Nakano

Kaneo Watanabe

Saburo Nakashima

A thin film transistor with a noncrystalline semiconductor film, wherein an amorphous semiconductor in a position corresponding to a channel between a source electrode and a drain electrode is polycrystallized, while on both side areas or around the polycrystallized area remains amorphous. The thin film transistor may be a noncrystalline semiconductor film with a heterojunction between a channel area and a source and drain area.

Thin film transistor

In a method of fabricating a semiconductor device according to the present invention, a semiconductor film is formed on a substrate, and an insulator film is formed so as to cover the semiconductor film. Then, a dopant source is arranged on the insulator film and then, a region for electrical contact is irradiated with a high-energy beam through the dopant source. Consequently, the insulator film and the semiconductor film in the irradiated region are melted, to form a polycrystalline contact region having impurities supplied from the dopant source doped therein. Thus, the high-energy beam is irradiated to the region for electrical contact through the dopant source to form the polycrystalline contact region, thereby to make it possible to omit the patterning process such as etching processing for providing a contact hole.

Method of fabricating semiconductor device

A semiconductor device according to the present invention comprises a semiconductor thin film, and first and second insulator films formed in such arrangement that the semiconductor thin film being sandwiched therebetween. First and second graded layers each containing a constitutent element of the semiconductor thin film and impurities and having a content of the impurities decreased in the direction of the semiconductor thin film are interposed between the semiconductor thin film and the respective insulator films, thereby to relax internal stress produced in the junction interfaces of the semiconductor thin film and the insulator films and to prevent cracking from occurring in the junction interfaces.

Semiconductor device which relieves internal stress and prevents cracking

A transparent photo detector device according to an aspect of the present invention comprises: a transparent insulator substrate; a plurality of light sensor elements dispersively disposed on a main surface of the substrate, said sensor element including a transparent front electrode, a semiconductor layer for photo electric function and an opaque back electrode formed in that order on the main surface of the substrate, said semiconductor layer being neither protracting from nor retracting into between said front and back electrodes; and a transparent wire pattern formed on the main surface of the substrate for electrically connecting the plurality of sensor elements.

Growing community of inventors

Osaka, Japan

Shoichiro Nakayama