Senju Metal Industry Co., Ltd.

Techmagic Inc.

Shohei Mawatari

Eiji Ishiwata

Yuji Shiraki

Hideki Nakamura

[Problem] To provide an automated cooking device which can efficiently scrape off a dirt, such as a burn sticking to an inner wall surface of a cooking container due to heating and cooking and remaining there after cooking. [Solution] An automated cooking devicecomprising: a cooking counterincluding a sink for washinga container holding unitconfigured to hold a cooking containerrotatably around a container central axis AC; and a scraping unitconfigured to wash an inner wall surface of the cooking container while the cooking container is turned upside down after stirring and cooking an ingredient I contained in the cooking container, the scraping unitincluding a scraperconfigured to scrape off a dirt B, such as a burn adhering to the cooking container and being configured to be enclosed by the inner wall surface upside down of the cooking container in the sink for washing and allow the inner wall surface of the cooking container and the scraper to abut against each other.

Automated cooking device

An automated cooking device includes a control unit controls the driving of a rotation driving mechanism of a container holding unit and a rotation unit so as to change the container holding unit to any of an ingredient receiving posture in which a cooking container receives ingredients I from an ingredient supply device, a cooking posture in which a container rotation mechanism rotates the cooking container in a state in which the cooking container is inclined with respect to a cooking table so as to stir the ingredients I, a serving posture in which the container holding unit is inclined with respect to the cooking table so as to make the cooking container face downward to a dish D, and a washing posture in which a rotation support mechanism of the container holding unit is inclined with respect to a base frame and the cooking container is washed.

An automated cooking device for washing a cooking container includes a controller controlling driving of a container holder to change the container holder to any of an ingredient receiving posture in which the cooking container receives ingredients from a supply device, a cooking posture in which the cooking container is rotated in a state in which the cooking container is inclined forward with respect to a cooking table to stir the ingredients, a serving posture in which the container holder is inclined forward more than in the cooking posture with respect to the cooking table to face downward to a dish on the front side of the container holder, and a washing posture in which a rotation support mechanism of the container holder is inclined backward with respect to a base frame and the cooking container is washed on a rear side of the container holder.

A solder dross removal apparatus includes a holder adapted to be pivotably mounted to a container within which a pool of molten solder is kept at preset temperature. Dross is introduced into the container. A dross cutter assembly includes shafts rotatably supported by the holder and flat elongated cutter elements mounted on the shafts. The cutter elements are disposed perpendicular to the surface of the molten solder and partly submerged in the molten solder when the container is closed by the holder. The cutter elements are angularly offset from each other so that each end of the cutter elements lies on a spiral path. The cutter elements are rotated to repeatedly cut the dross into smaller pieces and force the dross as cut into the molten solder. This process removes oxides from the dross, and any free, reclaimed solder is returned to the molten solder.

Solder dross removal apparatus and method

An automatic wave soldering apparatus includes a solder reservoir for holding a supply of molten solder and a solder nozzle vertically disposed in the solder reservoir to establish a solder wave through which a printed circuit board is moved. A pair of trapezoidal elements are secured within the nozzle. A Y-shaped baffle is disposed between the trapezoidal elements to form upwardly inclined narrowed upstream and downstream outlets. The upstream and downstream outlets are inclined at an acute angle against and in the direction of movement of the printed circuit board, respectively. A pair of valves are disposed at opposite sides of the baffle to selectively open and close the outlets. The bottom side of each of the trapezoidal elements forms a step to promote turbulence in the solder wave. The trapezoidal elements and the baffle collectively serve to increase the flow velocity of the molten solder through the outlets.

Automatic wave soldering apparatus and method

A printed circuit board which has been soldered in a molten solder bath is cooled immediately thereafter with a cooling liquid at a rate of at least 10&deg; C./second. Thermal effects of high-temperature solder during soldering are suppressed, and the metal matrix of the solder is refined, resulting in soldered connection of increased strength.

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Tokyo, Japan

Shohei Mawatari