Other

Planar Semiconductor, Inc.

Novellus Systems Incorporated

Gasonics International Corporation

Ferrotec Corporation

Shmuel Erez

Ben H Shelef

Rubinder S Randhawa

Harry Christov

Syed S Basha

Krishnan Shrinivasan

Cris Keith Kroneberger

Basha Sajjad

Ehood Geva

Karen Ann Reinhardt

Vladimir Starov

Ravi Vellanki

Arkadiy I Shimanovich

Aleksandr Kabansky

Art Hajjarian

Subhashish Sengupta

Basha S Sajjad

A kinematic mount with more than three mating elements. To function properly, the sum total of DOFs constrained by the mating elements is six. Mounts that have four mating elements&#x2014;for example a Pivot and three Spacers, or two Sliders and two Spacers, are beneficial. Conditions are shown under which the four-legged mounts are kinematic, stable and can be assembled from one direction, kinematic mount connecting two subassemblies along a mating direction, comprised of four mating elements, each mating element having two components, each attached to a different subassembly, two of said mating elements being Slider mating elements each having a Slide Axis and constraining two degrees of motion, and the other two of said mating elements each being a Spacer mating element each having a Spacer Axis and constraining a single degree of motion, said mating elements configured to jointly constrain six independent degrees of motion.

Kinematic mount

Cleaning and drying of semiconductor wafers is carried out in a single-chamber type cleaning/drying apparatus for flat objects such as semiconductor wafer, where cleaning is carried out by impinging both sides of the wafer which rotates at a relatively low speed with jets of a washing liquid and where subsequent drying is carried out in the same chamber by increasing the rotation speed of the wafer and supplying an isopropyl-alcohol (IPA) mist onto the wafer from the top of the chamber. After the IPA forms a solution with the residue of water on the wafer, the drying process is accelerated by supplying gaseous nitrogen through nozzles arranged on both side of the coaxial with the wafer center. As a result, the IPA-water solution quickly evaporates without leaving traces of water drops on the dried surface.

Method for precision cleaning and drying flat objects

A single-chamber type cleaning-drying apparatus for flat objects, such as semiconductor wafers, wherein cleaning is carried out by impinging both sides of the wafer, which rotates at a relatively low speed, with jets of a washing liquid and wherein subsequent drying is carried out in the same chamber by increasing the rotation speed of the wafer and supplying isopropyl-alcohol (IPA) mist onto the wafer from the top of the chamber. After the IPA forms a solution with the residue of water on the wafer, the drying process is accelerated by supplying gaseous nitrogen through nozzles arranged on both sides of the wafer he coaxially with the wafer center. As a result, the IPA-water solution quickly evaporates without leaving traces of water drops on the dried surface.

Single-chamber apparatus for precision cleaning and drying of flat objects

A substrate holding and rotary driving mechanism, e.g., for a cleaning chamber with vertical orientation of the wafer, that is comprised of a three-armed spider which is rotatingly installed on the outer side of the cleaning chamber and rotatingly supports on the outer ends of its arms outer shafts with eccentrically arranged inner shafts. The inner shafts pass through the outer shafts into the cleaning chamber where they support contact rollers, while the opposite ends of the inner shafts support gears driven into rotation by a synchronous belt. The contact rollers can be moved apart for insertion or removal of wafers from and into the chamber. This is achieved by turning the spider with eccentric inner shafts in one or another direction.

Holding and rotary driving mechanism for flat objects

A kinematic mount in which mobile spheroid bodies belonging to one component mate with conical depressions in a second component. The mobility of the spheroid bodies is achieved using round shafts and tight-fitting holes.

A lightweight reflector with a load bearing structure based on a tensile spoke-wheel. The spoke structure is especially compatible with dish parabolic mirrors, but has utility as a carrier structure for any round functional surface, including flat or slightly-curved mirrors used in central tower solar systems, parabolic dishes for radio telescopes and antennas, and for non-concentrating thin film solar panels. There are no radial members loaded in compression. All the spokes pull the rim inwards, and the rim is compressed in the circumferential direction. The imbalance in spoke tension results from the application of load provides the rigidity of the rim in respect to the hub, both for in-plane and out-of-plane forces. Ribs stiffen the spokes to resist wind and gravity, but are not structurally supported by either the hub or the rim. Lightweight reflector tiles match the wheel structure and create the reflective surface.

Solar receiver

Described is a planetary harmonic differential transmission, comprised of a rigid externally-toothed inner sprocket, a rigid internally-toothed outer sprocket, a deformable belt that is toothed on both its internal and external faces, and a set of free-rotating planetary sprockets that are mounted on a rotating carrier cage and cause the belt to progressively engage and disengage from successive portions of the rigid sprockets. The input to the transmission is the relative motion between the carrier cage and the inner sprocket, and the output is the relative motion between the outer sprocket and the inner sprocket, resulting in a differential transmission.

Planetary harmonic differential transmission

A method and an assembly of the invention are intended for connecting two parts via a spacer made from a heat-shrinkable material shrinkable only in one direction. The spacer is sandwiched between the parts and attached to both parts with such orientation that direction of the shrinkage of the spacer coincides with the direction of movement of both parts towards each other. After the parts and the spacer are interconnected, the spacer is heated for causing said parts to move closer to each other. The space between the parts can be filled with an adhesive material so that the parts will be held together without the use of clamps or binding bands while the adhesive is cured. Another application is to attach a heatsink to an electronic device supported by a PC board. Shrinkage of the spacer under effect of heating brings the electronic device into a tight heat-transferring contact with the heatsink and maintains this contact irreversibly. Another embodiment of the invention provides a spacer made from electroconductive heat-shrinkable material and is used not only for improving a heat-transfer contact between the source of heat and the heatsink, but also for grounding the heatsink against EMI.

Device and method for fastener-free connection via a heat-shrinkable insert

The heat-sink assembly of the invention is attached to the PC board with the use of surface mount technology. The assembly comprises a base part or a base member soldered to the PC board and a top part or a heat-sink member snapped-on through the central opening of the base member by irreversibly deforming bendable lugs which may have a radial or any other suitable shape. The bottom of the heat-sink member may be pushed down to physical contact with the top of the chip or to a position that leaves a space between the bottom of the heat-sink member and the top of the chip, so that the aforementioned space may be filled with a heat-conducting medium. It is an option to use the base part only. If necessary, a second heat-sink member of the same type, which could have different dimensions, can be soldered to the PC board side opposite to the chip. The heat sinks could be used with or without a fan. In the case of the assembly with a fan, the deice may have an air-flow guiding funnel formed on side portion of the base member.

Heat sink for automatic assembling

Adherent matrix layers such as post-etch and other post-process residues are removed from a substrate by exposing them to a vapor phase solvent to allow penetration of the vapor phase solvent into the adherent matrix layers and condensing the vapor phase solvent into the adherent matrix layers and revaporized to promote fragmentation of the matrix and facilitate removal. Megasonic energy may be transmitted via a transmission member to the adherent matrix through the solvent condensed thereon to loosen fragments and particles. The substrate is typically rotated to improve contact between the megasonic energy transmission member and the condensed solvent and achieve more uniform cleaning. A co-solvent which is soluble in the vapor phase solvent may be added to enhance removal of specific adherent matrix materials. A plasma pretreatment may be employed to react with and modify the matrix in a way that improves subsequent penetration by the vapor phase solvent and fragmentation of the adherent matrix for more complete removal from the substrate.

Method and apparatus for removing post-etch residues and other adherent matrices

A substrate handling apparatus includes a transfer elevator and a process station disposed inside a load lock chamber. The process station includes a top module, a bottom module, and a seal ring which is disposed between the top module and the bottom module and is movable to open and close the process station. The transfer elevator has an upper station spaced above a lower station. A transfer device having a pair of transfer arms is used to transfer substrates between the transfer elevator and the process station. The transfer arms are movable toward one another to support a substrate and apart from one another to release the substrate. The transfer arms are mounted to rotate between the transfer elevator and the process station. When a substrate is being processed inside the process station, the transfer arms are disposed on opposite sides of the process station. Upon completion of processing the substrate, the seal ring is opened, and the transfer arms move between the top module and seal ring to grasp the processed substrate and transfer it to the lower station of the transfer elevator (or upper station as desired) by simple rotation. The transfer arms are moved apart to release the processed substrate onto the lower station. The transfer elevator is lowered to align a fresh substrate disposed on the upper station with the transfer arms, which are moved toward one another to grasp the fresh substrate and transfer it to the process station by rotation. The transfer arms are then moved apart to release the fresh substrate into the process station. The seal ring of the process station is closed to seal the top and bottom modules together for processing the fresh substrate disposed therein.

Growing community of inventors

San Jose, CA, United States of America

Shmuel Erez