Kuraray Co., Ltd.

Maruishi Sangyo Co. Ltd.

Shinya Kato

Mitsuru Kato

Chihiro Okamoto

Minori Takegoshi

Hirofumi Kikuchi

Azusa Oshita

Kiyofumi Kadowaki

Takashi Katayama

Koji Hirai

Hisao Yoneda

Tetsuya Ashida

Toshiyasu Yajima

Shunji Kaneda

Shizuo Iwata

Tetsuya Watanabe

Yukio Goto

There is used a polyurethane for polishing layers that can be used as a material of a polishing layer of a polishing pad, the polyurethane including a thermoplastic polyurethane that is a reaction product of a polyurethane raw material including a polymer diol, an organic diisocyanate, and a chain extender, wherein the chain extender contains 50 mass % or more of a first chain extender including a straight-chain carbon backbone having 7 to 12 carbon atoms.

Polyurethane for polishing layer, polishing layer, and polishing pad

A modification method of a polyurethane, including the steps of: preparing a polyurethane having an ethylenically unsaturated bond; and treating the polyurethane with a liquid containing a compound having a conjugated double bond, or a modification method of a polyurethane, including the steps of: preparing a polyurethane having a conjugated double bond; and treating the polyurethane with a liquid containing a compound having an ethylenically unsaturated bond is used.

Modification method of polyurethane, polyurethane, polishing pad, and modification method of polishing pad

A Schiff base-containing chain extender may be a diol having a Schiff base or a derivative thereof, as well as a polyurethane produced using the same and a modification method thereof, and a polishing layer including a polyurethane and a polishing method using the polishing layer.

Polyurethane for polishing layer, polishing layer including polyurethane and modification method of the polishing layer, polishing pad, and polishing method

Provided is a polishing pad including a polishing surface having a zeta potential of +0.1 mV or more at a pH of 10.0. Preferably, a polishing pad including a polyurethane having a tertiary amine is provided. Further preferably, the polyurethane having a tertiary amine is a reaction product of a polyurethane reaction raw material containing at least a chain extender having a tertiary amine. A polishing method using the polishing pads is also provided, wherein the method is performed while supplying an alkaline polishing slurry.

Polishing pad and polishing method using same

Disclosed herein are polyurethanes useful for polishing layers, where the polyurethane is a polyurethane having a Schiff base. Also disclosed herein are polishing layers containing the polyurethanes, polishing methods that use the polishing layers, and a modification method including a step of converting the Schiff base into at least one functional group selected from an aldehyde group, a carboxylic acid group, a hydroxyl group, and an amino group.

Disclosed is a non-porous molded article for a polishing layer, the non-porous molded article including a thermoplastic polyurethane, wherein the thermoplastic polyurethane has a maximum value of a loss tangent (tan &#x3b4;) in a range of &#x2212;70 to &#x2212;50&#xb0; C. of 4.00&#xd7;10or less. Preferably, the thermoplastic polyurethane is obtained by polymerization of a polymer diol having a number average molecular weight of 650 to 1400, an organic diisocyanate, and a chain extender, and a content ratio of nitrogen derived from an isocyanate group of the organic diisocyanate is 5.7 to 6.5 mass %.

Non-porous molded article for polishing layer, polishing pad, and polishing method

Disclosed is a polishing-layer molded body including: a thermoplastic polyurethane that is a polymer of a monomer including: a polymer diol; an organic diisocyanate; a first chain extender including a diol having 4 or less carbon atoms; a second chain extender including a diol having 5 or more carbon atoms, a content ratio of nitrogen derived from an isocyanate group of the organic diisocyanate being 6.3 to 7.4 mass %, and the polishing-layer molded body being non-porous.

Polishing-layer molded body, and polishing pad

The present invention provides a slurry for chemical mechanical polishing comprising water-soluble clathrate compound (a), polymer compound (b) having an acidic group optionally in a salt form as a side chain, polishing abrasive grain (c) and water (d), wherein the content of the water-soluble clathrate compound (a) is 0.001 mass %-3 mass % of the total amount of the slurry, the polymer compound (b) has a weight average molecular weight of not less than 1,000 and less than 1,000,000, and the content of the polymer compound (b) is 0.12 mass %-3 mass % of the total amount of the slurry, and a polishing method for substrate using the slurry.

Slurry for chemical mechanical polishing and polishing method for substrate using same

The present invention provides a slurry for chemical mechanical polishing, containing abrasive grain (a), compound (b) having an amino group having a pKa of more than 9, and not less than 3 hydroxyl groups, and water.

Slurry for chemical mechanical polishing and chemical mechanical polishing method

The subject is to provide a polymer material which enables to improve planarity and planarization efficiency of a polished surface and is useful as a polishing pad which generates only a few scratches. The said subject is solved by a polymer material having a tensile modulus at 50&#xb0; C. after saturation swelling with 50&#xb0; C. water of 130 to 800 MPa, a loss tangent at 50&#xb0; C. of not more than 0.2, and a contact angle with water of not more than 80&#xb0;.

Polymer material, foam obtained from same, and polishing pad using those

To provide a polishing pad () useful for polishing semiconductor materials having a high hardness. The polishing pad () is used for polishing a workpiece () in combination with loose grains and comprises a polishing surface () comprising a textile of high-tenacity organic fibers, the fiber has a tenacity of not lower than 15 cN/dtex. In the textile, the high-tenacity organic fiber may have a single fiber fineness within the range between 0.3 dtex and 15 dtex, or a total fineness of within the range between 3 dtex and 3,000 dtex. The fiber may include, for example, a fully-aromatic polyester fiber.

Polishing pad

The invention provides a polishing pad to polish a metal layer. The polishing pad has a storage elastic modulus at 80&#xb0; C. of 200 to 900 MPa and a storage elastic modulus at 110&#xb0; C. of 40 MPa or less. The invention also provides a method of polishing a metal layer using the pad.

Metal film polishing pad and method for polishing metal film using the same

The invention provides a cushion for a polishing pad, wherein, when a dynamic compression viscoelasticity measurement is performed under conditions of 23&#xb0; C., a static load of 27.6 kPa, a frequency of 11 Hz and an amplitude of 1 &#x3bc;m, (1) a phase difference between dynamic stress and deformation is 4&#xb0; or less, and (2) a ratio of the maximum value of the deformation amount to the maximum value of the dynamic stress ([maximum value of deformation amount]/[maximum value of dynamic stress]) is 0.5 &#x3bc;m/kPa or more. The invention also provides a polishing pad having a layer of the cushion for a polishing pad and a polishing layer.

Cushion for polishing pad and polishing pad using the cushion

A laminate comprising a layer formed by melt molding a thermoplastic polyurethane and a fibrous base layer, a film or sheet melt molded from the thermoplastic polyurethane, and a thermoplastic polyurethane composition comprising the thermoplastic polyurethane and tin compound in an amount of 0.3 to 15 ppm (in terms of tin atom) based on the thermoplastic polyurethane; the thermoplastic polyurethane being a thermoplastic polyurethane obtained from a polymeric diol (a) having a number average molecular weight of 1,500 to 4,000, an organic diisocyanate (b) and a chain extender (c) and having an inherent viscosity of at least 0.9 dl/g and a retention of long-chain hard segments when heat melted of at least 80%, the polymeric diol (a) having a crystallization enthalpy (.DELTA.H) of not more than 70 J/g and having low molecular diol units comprising at least 30 mole % of 1,9-nonanediol units. These articles are excellent in resistance to abrasion melting and abrasion and resistance to bleed/whitening and also good in tensile strength and like mechanical properties, durability and cold resistance, as well as softness and flexibility, so that they can be used for leather-like products and other various purposes.

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Kurashiki, Japan

Shinya Kato