Hitachi, Ltd.

Renesas Technology Corp.

Hitachi Ulsi Systems Co., Ltd.

Hitachi Device Engineering Corp

Other

Shinya Kanamitsu

Shinji Tojo

Seiichi Ichihara

Makoto Kimura

Takahiro Fujioka

Akihiko Narisawa

Hiroyuki Mouri

Yoshiyuki Tanigawa

Koji Akimoto

Salient electrodes on a semiconductor chip and leads on a film substrate are to be connected together with a high accuracy. A change in lead pitch which occurs at the time of connecting salient electrodes on a semiconductor chip and inner leads on a film substrate with each other is taken into account and a correction is made beforehand to the pitch of the inner leads. Likewise, a change in lead pitch which occurs at the time of connecting electrodes on a liquid crystal substrate and outer leads on the film substrate with each other is taken into account and a correction is made beforehand to the pitch of the outer leads.

Method of manufacturing a semiconductor device

To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.

Semiconductor device and display unit using the semiconductor device and

To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip, a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.

Growing community of inventors

Mitaka, Japan

Shinya Kanamitsu