Canon Kabushiki Kaisha

Shinichiro Koga

Yoshihiro Ishida

Noburu Takakura

Nobuyuki Shigeeda

Shigeyuki Uzawa

Osamu Yoshizaki

Takeshi Kawazome

Takahiro Takiguchi

Akihiko Kawamura

Kazuhiko Mishima

Takahiro Oshino

Osamu Morimoto

Mitsuhiro Masuda

Satoru Jimbo

Yusuke Miura

A measurement apparatus measures position information of a measurement target in a first direction. The apparatus comprises a scope configured to capture an image of the measurement target and generate image data, and a processor configured to obtain, based on the image data, the position information of the measurement target in the first direction. The processor is configured to determines the position information of the measurement target in the first direction based on: provisional position information of the measurement target in the first direction obtained from the image data, and using a correction value which is output from a model by inputting, in the model, a feature quantity, of the image data, related to a second direction different from the first direction.

Measurement apparatus that measures position information of measurement target in predetermined direction

The present invention provides an information processing apparatus for determining, for a substrate having undergone an imprint process that forms a pattern of an imprint material, presence/absence of a formation defect of the pattern, including a generating unit configured to generate learning models in one-to-one correspondence with a plurality of different illumination conditions by using images obtained by capturing images of a plurality of substrates on which the pattern is formed under the plurality of illumination conditions, and an obtaining unit configured to input the images obtained by capturing images of the substrates having undergone the imprint process and containing the pattern, to a plurality of learning models generated by the generating unit, and obtain a temporary determination result temporarily indicating the presence/absence of a formation defect of the pattern from each of the plurality of learning models.

Information processing apparatus, determination method, imprint apparatus, lithography system, article manufacturing method, and non-transitory computer-readable storage medium

An information processing apparatus for acquiring an inspection condition for performing an inspection on a pattern formed by a lithography apparatus that forms a pattern on a substrate with an original includes an acquisition unit configured to acquire a second inspection condition to be applied in a case where an inspection is performed on a second pattern by inputting third information indicating a state of the lithography apparatus acquired when the second pattern is formed to a model, wherein the model is acquired by machine learning with learning data including first information indicating a state of the lithography apparatus acquired when a first pattern is formed and second information indicating a first inspection condition applied when an inspection is performed on the first pattern.

Information processing apparatus, storage medium, lithography apparatus, lithography system, and article manufacturing method

A substrate processing apparatus is provided. The apparatus includes an imaging unit that images a mark on a substrate, and a processor that aligns the substrate based on an image of the mark obtained by the imaging unit. If the alignment has failed, the processor identifies a factor of the failure based on information including the image and executes at least one of a plurality of recovery processes based on the identified factor. The processor includes an output unit that outputs a condition for the at least one of recovery processes in accordance with an inference model, and a learning unit that learns the inference model based on an execution result of the at least one of the recovery processes under the condition output from the output unit.

Substrate processing apparatus, article manufacturing method, substrate processing method, substrate processing system, management apparatus, and storage medium

Provided is a lithography apparatus that includes a plurality of patterning devices each of which is configured to perform patterning for a substrate supplied from a preprocessing apparatus; and a controller configured to control the plurality of patterning devices such that a plurality of substrates respectively belonging to a plurality of lots is subjected to parallel processings by the plurality of patterning devices based on a plurality of recipe information respectively corresponding to the plurality of lots, and transmit information regarding a schedule of the parallel processings to the preprocessing apparatus.

Lithography apparatus, lithography method, lithography system, storage medium, and article manufacturing method

The present invention provides a lithography apparatus for transferring a pattern formed on an original to each of a plurality of shot regions on a substrate, comprising a detection unit configured to detect a mark provided in the shot region and a mark provided on the original, and a control unit configured to control alignment between a target shot region and the pattern of the original such that the mark in the target region detected by the detection unit and the mark on the original are shifted by a positional shift amount which is generated between each mark in the shot region and each mark on the original when an overlay error between the shot region and the pattern of the original falls within an allowable range.

Lithography apparatus, alignment method, and method of manufacturing article

An exposure apparatus includes a controller configured to calculate a position of an alignment mark detected by a detector, to approximate a deformation of a substrate by using an approximation equation, to calculate a correction amount of each of the plurality of shots, and to control driving of a stage in exposing each shot based on a correction amount that is calculated. The approximation equation is defined as a sum of a first term representative of a deformation of the entire substrate, and at least one of a second term representative of a distortion of a shot arrangement and a third term representative of a shot shape.

Exposure apparatus

An exposure apparatus sequentially transfers a pattern of an original to a plurality of shot regions on a substrate, wherein each shot region includes a chip region and a scribe line region surrounding the chip region. The apparatus includes a detector configured to detect light beams from a first mark and a second mark arranged in a first scribe line region and a second scribe line region, respectively, adjacent to each other on the substrate driven in a measurement scanning direction by substantially simultaneously observing the first scribe line region and the second scribe line region, and a processor configured to process detection signals output from the detector to determine positions of the first mark and the second mark, wherein the substrate is positioned based on the positions of the first mark and the second mark and is exposed.

Exposure apparatus, exposure method, and device manufacturing method

An exposure apparatus is configured to project a pattern of an original onto a substrate using a projection optical system, thereby exposing the substrate, and comprises a substrate stage configured to hold the substrate, a first detector configured to detect positions of marks on the substrate in a first direction and a second direction orthogonal to each other in a plane perpendicular to an optical-axis direction of the projection optical system, and a controller configured to control the first detector to detect the position of a mark on the substrate while moving the substrate stage substantially along the first direction, and control the first detector to detect the position of a mark on the substrate while moving the substrate stage substantially along the second direction, thereby controlling positioning and exposure of the substrate based on the detection results obtained by the first detector.

Exposure apparatus and device manufacturing method

An exposure method of exposing a substrate arranged on a stage, which holds the substrate and moves, to light through an original and a projection optical system. A first measurement is performed for measuring a first drive characteristic of the stage by detecting a position of a pattern on the stage using a first detection system, which detects a position of a pattern on the substrate through an optical system, which does not include the projection optical system, a second measurement is performed for measuring a second drive characteristic of the stage by detecting the position of the pattern on the stage using a second detection system, which detects the position of the pattern on the stage through the projection optical system, and the original and the substrate are aligned based on the first and second drive characteristics.

Exposure method and apparatus, and device manufacturing method

An exposure apparatus includes an original stage arranged to hold a reflective original having a pattern, a substrate stage arranged to hold a substrate, an illumination optical system arranged to emit exposure light along a first direction inclined from a direction of a reflection surface of the reflective original, a projection optical system arranged to project the pattern onto the substrate along a second direction using the exposure light reflected by the reflection surface of the reflective original, an original reference member arranged on the original stage or the reflective original, a substrate reference member, having a substrate mark, arranged on the substrate stage or the substrate, and a detector arranged to detect light from the substrate mark of the substrate reference number, which is illuminated with light.

Exposure apparatus, focal point detecting method, exposure method and device manufacturing method

In one aspect, an image processing apparatus inputs an input image signal and detecting whether or not there is a frame change in an image by comparing the input image signal with a reference image signal. A memory is used for updating the reference image signal by storing the input image signal as the reference image signal in units of frames when there is a frame change. In another aspect, the image processing apparatus extracts change components between images by comparing the input image signal with the reference image signal, the reference image signal being an earlier input signal when a most recent prior change component was extracted. The extracted change components are corrected by detecting and removing an erroneously extracted change component, and an image change is discriminated in the input image signal on the basis of the change components as corrected.

Image processing apparatus for detecting changes of an image signal and image processing method therefor

A digital color image to be processed is inputted at a color image input step, image segments are extracted from the input color image at an image-segment extraction step, and the data of the extracted image segments is created. Next, image-segment components in each extracted image segment are discriminated at an image-segment discrimination step, and each extracted image segment is subjected to zoom processing, which conforms to the discriminated image-segment component, at an adaptive zoom step, thereby creating a zoomed image of the input image. The zoomed image that has been created is displayed, outputted as a hard copy or delivered to a transmission line at a color image output step. Accordingly, a color image in which image segments having different characteristics are mixed can be subjected to excellent processing.

Image processing apparatus and method

A position measuring method for measuring a position of a mark formed on an object, includes detecting a mark waveform obtainable from the mark, acquiring a difference between the detected mark waveform and a reference waveform, correcting at least one of the mark waveform and the reference waveform on the basis of the acquired difference, and determining the position of the mark on the basis of (i) the corrected mark waveform and the reference waveform, (ii) the mark waveform and the corrected reference waveform, or (iii) the corrected waveform and the corrected reference waveform.

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Utsunomiya, Japan

Shinichiro Koga