Globalwafers Japan Co., Ltd.

Shingo Narimatsu

Takeshi Senda

Hironori Banba

Takashi Ishikawa

Hiromichi Isogai

Jun Nakao

Hiroyuki Abiko

Yoshiaki Abe

Michihiro Ohwa

The substrate is doped with P, has a resistivity adjusted to 1.05 mΩ·cm or less, and includes defects, formed in the crystal by the aggregation of P, which are Si—P crystal defects substantially. The method includes a step of forming a silicon oxide film on the backside of the substrate with a thickness of 300 nm or more and 700 nm or less, a step of mirror-polishing the substrate, and after the mirror-polishing step, a heat treatment step of the substrate mounted on a substrate holder made of Si or SiC, on the holder surface a silicon oxide film is formed with the thickness between 200 nm and 500 nm, wherein the thickness X of the silicon oxide film of the holder and the thickness Y of that on the backside of the substrate satisfy a relational expression Y=C−X, where C is a constant between 800 and 1000.

Manufacturing method for semiconductor silicon wafer

A method and an apparatus of pulling single crystals are provided that allows adding dopants efficiently into the silicon melt without causing to generate dislocations and obtainment of single crystals with low resistivity, during forming the former half of a product portion after the formation of the shoulder, when pulled up from the silicon melt by the Czochralski method. The method includes steps of forming an inert gas flow G that flows from above toward the silicon melt Malong the inside of a heat shielddisposed to surround the silicon crystal C to be grown in the furnace and expands in radial directions along the surface of the silicon melt and is exhausted to the outside of the furnace, gasifying a dopant in the furnace, discharging the gasified dopant into the inside of the heat shield, and flowing the gasified dopant carried by the inert gas flow.

Method and apparatus for pulling single crystal

A semiconductor silicon wafer manufacturing method is provided, where P aggregate defects and SF in an epitaxial layer can be suppressed. A silicon wafer substrate cut from a monocrystal ingot is doped with phosphorus and has a resistivity of 1.05 mΩ·cm or less and a concentration of solid-solution oxygen of 0.9×10atoms/cm. The method includes steps of mirror-polishing substrates and heat treatment, where after the mirror-polishing step, the substrate is kept at a temperature from 700° C. to 850° for 30 to 120 minutes, then after the temperature rise, kept at a temperature from 1100° C. to 1250° for 30 to 120 minutes, and after cooling, kept at a temperature from 700° C. to 450° C. for less than 10 minutes as an experience time. The heat treatment step is performed in a mixture gas of hydrogen and argon. The method includes an epitaxial layer deposition step to a thickness of 1.3 μm to 10.0 μm.

According to one exemplary embodiment, a single crystal pulling-up apparatus of pulling-up silicon single crystals by a Czochralski method, is provided with: a neck diameter measuring portion which measures a diameter of a grown neck portion; a first compensation portion which outputs a first compensated pulling-up speed for the seed crystals based on a difference between a measured value of the diameter of the neck portion and a target value of the neck portion diameter previously stored; a second compensation portion which outputs a second pulling-up speed while limiting an upper limit of the first pulling-up speed to a first limit value; and a crucible rotation number compensation portion which lowers the number of a rotation of a crucible at least in a period where the upper limit of the first pulling-up speed is limited to the first limit value.

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Niigata, Japan

Shingo Narimatsu