Macronix International Co., Ltd.

Tsinghua University

Skymedi Corporation

Shin-Jang Shen

Chun-Hsiung Hung

Hang-Ting Lue

Meng-Fan Chang

Yi-Ching Liu

Shuo-Nan Hung

Wei-Jen Chen

Yih-Shan Yang

Chia-Chi Liu

Chih-Ting Hu

Yu-Fan Lin

Fu-Chia Shone

Yu-Der Chih

Kuen-Long Chang

Chung-Kuang Chen

Ken-Hui Chen

Chun-Lien Su

Chun Hsiung Hung

Ya-Jui Lee

Ho-Chun Liou

Yu-Shen Lin

Shih-Chou Juan

Hsien-Hung Wu

Hsin-Chien Chen

Bo-Chang Wu

Che-Ping Chen

Ming-Yi Chang

Chien-Ping Tai

Chuan Ying Yu

Lo Chi

Meng-Fan Cheng

Yu-Der Chen

Yi-Lun Lu

Wan-Ying Lu

Systems, devices, methods, and circuits for managing power supply in semiconductor devices are provided. The semiconductor devices can include 3D NAND flash memory devices with high capacity and/or high performance. In one aspect, a semiconductor device includes: a voltage pump, a pump switch circuit configured to be coupled to the voltage pump, and an interface including a voltage pin coupled to the pump switch circuit. The voltage pump has an input, an output, and a series of pump stages coupled between the input and the output. The pump switch circuit is configured to provide an input voltage received at the voltage pin to a corresponding node in the voltage pump to select a corresponding number of pump stages of the series of pump stages to output a target voltage at the output of the voltage pump.

Managing power supply in semiconductor devices

A flash memory and an operation method thereof are provided. The flash memory includes a plurality of memory cell strings and a pass voltage generator. Each of the memory cell strings includes a plurality of memory cells. The pass voltage generator is configured to provide a pass voltage to a plurality of word lines of a plurality of unselected memory cells of a selected memory string. During a reading operation, the pass voltage generator raises the pass voltage from a first voltage at a first time point, and raises the pass voltage to a second voltage at a second time point. The second voltage is lower than a target voltage times a preset ratio The first time point is earlier than a start time point of a bit line voltage received by the selected memory cell, and the second time point occurs at the start time point of the bit line voltage.

Flash memory and operation method thereof for controlling raising speed of the read pass voltage

A memory device comprises a first NAND string that includes a first plurality of memory cells and a first string select switch arranged in series, the first string select switch disposed between a first bit line and a first end of the first plurality, a second NAND string that includes a second plurality of memory cells and a second string select switch arranged in series, the second string select switch disposed between a second bit line and a first end of the second plurality, word lines coupled to memory cells in the first plurality and memory cells in the second plurality, and a string select line coupled to the first and second string select switches. A method of operating such a memory device comprises applying a voltage varying in a manner complementary to absolute temperature to at least one of the word lines and the string select line.

Temperature compensation for unselected memory cells and string select switches in NAND flash memory

A circuit for adjusting a select gate voltage of a non-volatile memory is provided. The circuit includes a well, a select gate, and an adjustment unit. There is a capacitive coupling between the well and the select gate. The adjustment unit generates a driving voltage for the select gate based on a non-constant voltage.

Circuit and method for adjusting select gate voltage of non-volatile memory during erasure of memory cells based on a well voltage

A boost circuit includes a power rail to provide a supply voltage, a switch transistor controlling output of a boosted signal from a source of the switch transistor, and a timing and voltage control circuit configured to generate an equalization (EQ) signal to be applied to a gate of the switch transistor. The EQ waveform has a level being an EQ high level, an EQ low level lower than the EQ high level, or an EQ clamped level between the EQ low level and the EQ high level.

Boost circuit

A circuit for adjusting a select gate voltage of a non-volatile memory is provided. The circuit includes a well, a select gate, an adjustment unit, and a switch. There is a capacitive coupling between the well and the select gate. The adjustment unit generates a driving voltage for the select gate. The switch is coupled in series with the adjustment unit between the select gate and the well.

Circuit for adjusting a select gate voltage of a non-volatile memory during erasure of memory cells based on a well voltage

A level shifter receiving an input with a relatively narrow voltage range and provides an output with a relatively wide voltage range. The level shifter including a transistor with a turn-on voltage. Control circuitry applies a bias to the level shifter such that the transistor does not receive the turn-on voltage.

Level shifter and decoder for memory

A method and a circuit for generating a clock signal from a clock integrated circuit are introduced herein. A compensation voltage is generated according to a temperature coefficient of a resistor and a clock period of a clock circuit, where the compensation voltage is resistor-corner independent. The clock period of the clock circuit is determined by the resistor and at least one capacitor of the clock circuit. The temperature dependence of the clock period of the clock circuit is reduced according to the compensation voltage.

Method and circuit for temperature dependence reduction of a RC clock circuit

A 3D memory device includes a plurality of ridge-shaped stacks, in the form of multiple strips of conductive material separated by insulating material, arranged as strings which can be coupled through decoding circuits to sense amplifiers. Diodes are connected to the bit line structures at either the string select of common source select ends of the strings. The strips of conductive material have side surfaces on the sides of the ridge-shaped stacks. A plurality of conductive lines arranged as word lines which can be coupled to row decoders, extends orthogonally over the plurality of ridge-shaped stacks. Memory elements lie in a multi-layer array of interface regions at cross-points between side surfaces of the conductive strips on the stacks and the conductive lines.

Memory architecture of 3D array with diode in memory string

A 3D memory device includes a plurality of ridges, in some embodiments ridge-shaped, in the form of multiple strips of conductive material separated by insulating material, arranged as bit lines which can be coupled through decoding circuits to sense amplifiers. The strips of conductive material have side surfaces on the sides of the stacks. A plurality of conductive lines arranged as word lines which can be coupled to row decoders, extends orthogonally over the plurality of stacks. The conductive lines conform to the surface of the stacks. Memory elements lie in a multi-layer array of interface regions at cross-points between side surfaces of the semiconductor material strips on the stacks and the conductive lines. The memory elements are programmable, like the anti-fuses or charge trapping structures. In some embodiments, the 3D memory is made using only two critical masks for multiple layers. Some embodiments include a staircase-shaped structure positioned at ends of the semiconductor material strips. Some embodiments include SSL interconnects on a metal layer parallel to the semiconductor material strips, and further SSL interconnects on a higher metal layer, parallel to the word lines.

3D memory array with improved SSL and BL contact layout

One embodiment of the technology is an apparatus, a memory integrated circuit. The memory integrated circuit has word line address decoding circuitry. The circuit allows selection of a single word line to have an erase voltage. A decoder circuit includes an inverter and logic. The inverter has an input, and an output controlling a word line to perform the erase operation. A voltage range of the input extends between a first voltage reference and a second voltage reference. Examples of voltages references are a voltage supply and a ground. In some embodiments, this wide voltage range results from the input being free of a threshold voltage drop from preceding circuitry limiting the voltage range of the input. The logic of the decoder is circuit is controlled by a word line address to determine a value of the input of the inverter during the erase operation.

Word line decoder circuit apparatus and method

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Hsinchu, Taiwan

Shin-Jang Shen