United Microelectronics Corp.

Radiant Opto-Electronics (Suzhou) Co., Ltd.

Shih-Hsien Chen

Chih-Sheng Chang

Ching-Li Yang

Shih-Che Huang

Meng-Jun Wang

Yong-Wei Zhao

Ting-Chun Wang

Hao-Ling Yen

A method of manufacturing a die seal ring including the following steps is provided. A dielectric layer is formed on a substrate. Conductive layers stacked on the substrate are formed in the dielectric layer. Each of the conductive layers includes a first conductive portion and a second conductive portion. The second conductive portion is disposed on the first conductive portion. A width of the first conductive portion is smaller than a width of the second conductive portion. A first air gap is formed between a sidewall of the first conductive portion and the dielectric layer. A second air gap is formed between a sidewall of the second conductive portion and the dielectric layer.

Method of manufacturing die seal ring

A die seal ring and a manufacturing method thereof are provided. The die seal ring includes a substrate, a dielectric layer, and conductive layers. The dielectric layer is disposed on the substrate. The conductive layers are stacked on the substrate and located in the dielectric layer. Each of the conductive layers includes a first conductive portion and a second conductive portion. The second conductive portion is disposed on the first conductive portion. A width of the first conductive portion is smaller than a width of the second conductive portion. A first air gap is disposed between a sidewall of the first conductive portion and the dielectric layer. A second air gap is disposed between a sidewall of the second conductive portion and the dielectric layer. The die seal ring and the manufacturing method thereof can effectively prevent cracks generated during the die sawing process from damaging the circuit structure.

Die seal ring and manufacturing method thereof

A method for fabricating semiconductor device includes the steps of: providing a substrate having a first inter-metal dielectric (IMD) layer thereon; forming a first metal interconnection and a second metal interconnection in the first IMD layer; removing part of the first IMD layer to form a recess between the first metal interconnection and the second metal interconnection; performing a curing process; and forming a second IMD layer on the first metal interconnection and the second metal interconnection.

Metal interconnect structure and method for fabricating the same

A fastener includes a head portion and a shank portion that extends from the head portion. The shank portion has a distal end that is distal from the head portion and that is formed with at least two bendable anchor segments. The fastener is used to fasten a base plate of a light emitting bar to a base of a light source module.

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Kaohsiung, Taiwan

Shih-Hsien Chen