Taiwan Semiconductor Manufacturing Comp. Ltd.

Au Optronics Corporation

Shih-Hsien Chen

Chun-Yao Ko

Felix Ying-Kit Tsui

Hau-Yan Lu

Liang-Tai Kuo

Kuang-Tao Sung

Chen-Ming Huang

Po-Wei Liu

Wen-Tuo Huang

Hung-Ling Shih

Yu-Ling Hsu

Chia-Sheng Lin

Yu-Chun Chang

Wei-Lin Chang

ShihKuang Yang

Yu-Hsiang Yang

Ta-Chuan Liao

Wen-Shun Lo

YingKit Felix Tsui

Chien-Kuo Yang

Tai-Yi Wu

Chien-Kao Yang

Ying-Kit Tsui

Chi-Feng Tsai

A semiconductor structure includes a first well region disposed within a substrate and comprising a first doping type. A conductive structure overlies the first well region. A pair of first doped regions is disposed within the first well region on opposing sides of the conductive structure. The pair of first doped regions comprise a second doping type opposite the first doping type. A pair of second doped regions is disposed within the first well region on the opposing sides of the conductive structure. The pair of second doped regions comprise the second doping type and are laterally offset from the pair of first doped regions by a non-zero distance.

Non-volatile memory (NVM) cell structure to increase reliability

A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.

ONON sidewall structure for memory device and method for making the same

In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a floating gate electrode disposed over the substrate, a contact etch stop layer (CESL) structure disposed over the floating gate electrode, an insulating stack separating the floating gate electrode from the CESL structure, the insulating stack including a first resist protective layer disposed over the floating gate electrode, a second resist protective layer disposed over the first resist protective layer, and an insulating layer separating the first resist protective layer from the second resist protective layer.

Method to improve data retention of non-volatile memory in logic processes

ONON sidewall structure for memory device and methods of making the same

Various embodiments of the present disclosure are directed towards an integrated chip including a first well region and a second well region disposed within a substrate. A gate electrode overlies the first well region and the second well region. A first memory active region is disposed within the second well region. A second memory active region is disposed within the second well region and is laterally offset from the first memory active region by a non-zero distance.

An integrated chip includes a first well region, second well region, and third well region disposed within a substrate. The second well region is laterally between the first and third well regions. An isolation structure is disposed within the substrate and laterally surrounds the first, second, and third well regions. A floating gate overlies the substrate and laterally extends from the first well region to the third well region. A dielectric structure is disposed under the floating gate. A bit line write region is disposed within the second well region and includes source/drain regions disposed on opposite sides of the floating gate. A bit line read region is disposed within the second well region, is laterally offset from the bit line write region by a non-zero distance, and includes source/drain regions disposed on the opposite sides of the floating gate.

A memory cell may include first and second storage transistors. A first capacitor includes a first capacitor active region disposed within a substrate and a capacitor plate comprised of a first floating gate portion of a floating gate. A second capacitor includes a second capacitor active region disposed within the substrate and a capacitor plate comprised of a second floating gate portion of the floating gate. The first storage transistor includes source/drain regions disposed within a bit line write region and a first gate electrode comprised of a third floating gate portion of the floating gate. The second storage transistor includes source/drain regions disposed within a bit line read region and a second gate electrode comprised of a fourth floating gate portion of the floating gate. The bit line read and write regions are offset from one another by a non-zero distance.

A semiconductor device is provided. The semiconductor device comprises a first active region, a second active region and a third active region, a first poly region, a second poly region, a third poly region, a first doped region and a second doped region. The first active region, the second active region and the third active region are separated and parallel with each other. The first poly region is arranged over the first and second active regions. The second poly region is arranged over the first and second active regions. The third poly region is arranged over the second and third active regions. The first doped region is in the second active region and between the first poly region and the second poly region. The second doped region is in the second active region and between the second poly region and the third poly region.

Non-volatile memory and method of manufacturing same

A memory system is provided. The memory system includes a number of memory cells and a number of bit lines. The memory cells are interlocked with each other in rows and columns. The memory cells include respective capacitors, respective first transistors and respective second transistors. Respective upper plates of the respective capacitors are electrically connected to respective gates of the respective first transistors, and respective drains of the respective second transistors are connected to respective sources of the respective first transistors. The bit lines are arranged along an extending direction of the rows. Respective bit lines are connected to the respective first transistors through respective bit-line contacts, and each of the respective bit-line contacts is shared by two adjacent memory cells of the extending direction of the rows.

Memory system and memory cell having dense layouts

A memory cell includes a first transistor coupled to a source line, wherein the first transistor is in a first well. The memory cell further includes a second transistor coupled to the first transistor and a bit line, wherein the second transistor is in the first well. The memory cell further includes a first capacitor coupled to a word line and the second transistor, wherein the first capacitor is in a second well. The memory cell further includes a second capacitor coupled to the second transistor and an erase gate, wherein the second capacitor is in the second well. In some embodiments, the first well contacts the second well on a first side of the first well.

Memory cell including a plurality of wells

A memory device includes at least one memory cell. The memory cell includes first and second transistors, and first and second capacitors. The first transistor is coupled to a source line. The second transistor is coupled to the first transistor and a bit line. The first capacitor is coupled to a word line and the second transistor. The second capacitor is coupled to the second transistor and an erase gate.

Memory device and memory cell

Non-volatile memory and method of manufacturing the same

A non-volatile memory structure includes a semiconductor substrate and a first layer of a first dopant type in the semiconductor substrate. The non-volatile memory structure further includes a first well region of a second dopant type over the first layer, a second well region of the second dopant type over the first layer and spaced apart from the first well region, and a third well region of the first dopant type disposed between the first well region and the second well region and extending downward to the first layer.

Growing community of inventors

Zhubei, Taiwan

Shih-Hsien Chen