Tokyo Electron Limited

Shigeto Tsuruta

Yuji Mimura

Eiji Manabe

Hisanori Hizume

Kimio Motoda

Shinichi Shinozuka

Takayuki Ishii

Takashi Terada

Yoshitaka Otsuka

Hiroshi Maeda

Takahiro Masunaga

Tetsuya Maki

Atsushi Yamashita

Tatsumi Oonishi

Hironori Tanoue

Jun Yada

Daisuke Ikemoto

A bonding system includes a bonding device, an inspection device and a controller. The bonding device forms a combined substrate by bonding a first substrate and a second substrate to each other. The inspection device inspects the combined substrate. The controller controls the inspection device. The controller includes a measurement controller, a comparison unit and a re-measurement controller. The measurement controller causes the inspection device to measure the combined substrate at a first number of measurement points. The comparison unit compares, with a reference, an inspection result including a deviation amount between the first substrate and the second substrate in the combined substrate based on a measurement result. The re-measurement controller causes the inspection device to re-measure the combined substrate at a second number of measurement points greater than the first number of measurement points based on a comparison result obtained by the comparison unit.

Bonding system and inspection method of inspecting combined substrate

A measuring method includes measuring a displacement A, placing an imaging unitat a position where the imaging unit is allowed to image a measurement mark MI and imaging the measurement mark M. In the measuring of the displacement A, the displacement Aof a surface of a combined substrate, which is composed of two sheets of substrates bonded to each other, on a side of the imaging unitat a position where the measurement mark Mfor position deviation measurement, which is provided within the combined substrate, is placed is measured. In the imaging of the measurement mark M, the measurement mark Mis imaged by the imaging unitwhile putting the measurement mark Min focus by moving a focal position back and forth with respect to a focal position which is previously set based on the displacement A

Measuring method and measuring device

Disclosed is a coating apparatus configured to properly detect a liquid surface of a coating liquid stored within a slit nozzle. The disclosed coating apparatus includes a slit nozzle, a moving mechanism, a storage portion illumination unit, and an imaging unit. The slit nozzle includes an elongated main body, a storage portion configured to store a coating liquid within the main body, and a slit-shaped ejecting port configured to eject the coating liquid fed from the storage portion through a slit-shaped flow path, wherein at least a part of each of a first wall and a second wall which face each other in the main body is formed of a transparent member. The moving mechanism is configured to move the slit nozzle with respect to a substrate. The storage portion illumination unit is configured to illuminate an inside of the storage portion through the transparent member of the first wall. The imaging unit is configured to image the inside of the storage portion through the transparent member of the second wall.

Coating apparatus and liquid surface detecting method

A coating apparatus includes: a slit nozzle including a retention chamber that retains the coating material; a moving mechanism that moves the slit nozzle; a pressure regulation unit that regulates a pressure inside the retention chamber; and a control unit that controls the moving mechanism and the pressure regulation unit to relatively move the slit nozzle with respect to the substrate while changing the pressure inside the retention chamber toward an atmospheric pressure from a negative pressure, wherein the control unit is configured to control the pressure regulation unit so that a change in the pressure inside the retention chamber in a start zone including a coating start position and an end zone including a coating end position becomes slower than a change in the pressure inside the retention chamber in a middle zone except the start zone and the end zone.

Coating apparatus

A coating apparatus includes a nozzle, a moving mechanism, a pressure adjusting unit and a pressure control unit. The nozzle is provided with a storage chamber and a slit-like flow path, and configured to discharge the coating liquid from a discharge port formed at a front end of the flow path. The moving mechanism moves the nozzle and a substrate relatively to each other along the surface of the substrate. The pressure adjusting unit adjusts the pressure inside the storage chamber. The pressure control unit controls the pressure adjusting unit so as to adjust pressure inside the storage chamber. The pressure control unit controls the pressure adjusting unit such that the inside of the storage chamber becomes a negative pressure, and fills the coating liquid inside the storage chamber while slowly decreasing the negative pressure inside the storage chamber.

Coating apparatus and method for filling coating liquid

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Kumamoto, Japan

Shigeto Tsuruta