Hitachi Chemical Company, Ltd.

Shigemitsu Yoshie

Kazumasa Fukuda

Atsushi Kuwano

Tomoo Nishiyama

Naoki Hara

Yasuo Miyazaki

A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 &#x3bc;m and less than 1 &#x3bc;m, not less than 1 &#x3bc;m and less than 10 &#x3bc;m, from 10 &#x3bc;m to 50 &#x3bc;m, and from 20 &#x3bc;m to 100 &#x3bc;m, and in which a peak present in a range of from 10 &#x3bc;m to 50 &#x3bc;m includes an aluminum oxide particle, and a peak present in a range of from 20 &#x3bc;m to 100 &#x3bc;m includes a boron nitride particle. In Formula (I) each of R, Rand Rindependently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7. 

Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device

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Tokyo, Japan

Shigemitsu Yoshie