Tokyo Seimitsu Co., Ltd.

Shigeharu Arisa

Toshiyuki Ozawa

A wafer grinding method and a wafer grinding machine are disclosed for grinding a wafer by executing both the rough grinding process and the finish grinding process. After the rough grinding process before the finish grinding process, the wafer thickness is measured with a noncontact-type thickness gauge, and during the finish grinding process, the finish thickness is finely adjusted by use of a contact-type thickness gauge and referring to the measurement data of the noncontact-type thickness gauge.

Wafer grinding method and wafer grinding machine

A wafer is supplied from a wafer cassette to an etching part by a wafer transport robot so as to be etched. After the etching process, a wafer frame is supplied from a wafer frame supply part to a mount part. The mount part to which the wafer frame is supplied moves to the upper part of a processing vessel of the etching part, and mounts the wafer at that position. After that, the mount part returns to its original position. A wafer frame collecting robot collects the wafer frame from the mount part that has returned to its original position, and stores the wafer frame in the wafer frame cassette.

Etching apparatus

The reverse of a wafer is processed after adhering a protecting sheet and a reinforcing plate to the obverse of a wafer. The wafer is mounted on a frame for dicing via a dicing sheet and diced. Then, the protecting sheet is separated from the wafer after irradiating the wafer with ultraviolet light.

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Mitaka, Japan

Shigeharu Arisa