Chinese Academy of Sciences

Shibing Long

Ming Liu

Qi Liu

Hangbing Lv

Zongliang Huo

Yan Wang

Yanhua Wang

Qing Luo

Xiaoxin Xu

Kangwei Zhang

Sen Liu

Writam Banerjee

Wei Wang

Feng Zhang

Chenxi Zhu

Ling Li

Changqing Xie

Feng Yan

Qin Hua Wang

Keke Zhang

Jiebin Niu

Haitao Sun

Nianduan Lu

Xumeng Zhang

Xiaolong Zhao

Chong Bi

Pengxiao Sun

Haltao Sun

Manhong Zhang

Facai Wu

Qingyun Zuo

A neuron circuit (), including a memristive element (M) used to receive an excitation signal; a trigger element (D) connected to the memristive element (M) and used to receive a clock control signal for the neuron circuit and an output signal of the memristive element (M); a feedback element (T) connected to an output end of the trigger element (D) and an input end of the memristive element (M), and used to control a voltage at the input end of the memristive element (M); and an AND circuit (A) used to perform an AND operation on an output signal of the trigger element (D) and the clock control signal. An output signal of the AND circuit (A) acts as an output signal of the neuron circuit ().

Neuron circuit and neural network circuit

A RRAM and a method for fabricating the same, wherein the RRAM comprises: a bottom electrode; an oxide layer containing a bottom electrode metal, disposed on the bottom electrode; a resistance-switching layer, disposed on the oxide layer containing a bottom electrode metal, wherein the resistance-switching layer material is a nitrogen-containing tantalum oxide; an inserting layer, disposed on the resistance-switching layer, wherein the inserting layer material comprises a metal or a semiconductor; a top electrode, disposed on the inserting layer. By providing the to resistance-switching layer with a nitrogen-containing tantalum oxide, compared with TaO, the RRAM of the present disclosure has a low activation voltage and a high on-off ratio, and can enhance the control capability over the device resistance by the number of oxygen vacancies.

Resistance random access memory and method for fabricating the same

The present disclosure provides a conductive bridge semiconductor device and a method of manufacturing the same. The conductive bridge semiconductor device includes a lower electrode, a resistive switching functional layer, an ion barrier layer and an active upper electrode from bottom to top, wherein the ion barrier layer is provided with certain holes through which active conductive ions pass. Based on this structure, the precise designing of the holes on the barrier layer facilitates the modulation of the quantity, size and density of the conduction paths in the conductive bridge semiconductor device, which enables that the conductive bridge semiconductor device can be modulated to be a nonvolatile conductive bridge resistive random access memory or a volatile conductive bridge selector. Based on the above method, ultra-low power nonvolatile conductive bridge memory and high driving-current volatile conductive bridge selector with controllable polarity are completed.

Conductive bridge semiconductor component and manufacturing method therefor

An operation method for integrating logic calculations and data storage based on a crossbar array structure of resistive switching devices. The calculation and storage functions of the method are based on the same hardware architecture, and the data storage is completed while performing calculation, thereby realizing the fusion of calculation and storage. The method includes applying a pulse sequence to a specified word line or bit line by a controller, configuring basic units of resistive switching devices to form different serial-parallel structures, such that three basic logic operations, i.e. NAND, OR, and COPY, are implemented and mutually combined on this basis, thereby implementing 16 types of binary Boolean logic and full addition operations, and on this basis, a method for implementing a parallel logic and full addition operations is provided.

Method for implementing logic calculation based on a crossbar array structure of resistive switching device

Provided are a self-gating resistive storage device and a method for fabrication thereof; said self-gating resistive storage device comprises: lower electrodes; insulating dielectric layers arranged perpendicular to, and intersecting with, the lower electrodes to form a stacked structure, said stacked structure being provided with a vertical trench; a gating layer grown on the lower electrodes by means of self-alignment technique, the interlayer leakage channel running through the gating layer being isolated via the insulating dielectric layers; a resistance transition layer arranged in the vertical trench and connected to the insulating dielectric layers and the gating layer; and an upper electrode arranged in the resistance transition layer. In the storage device provided by the described technical solution, the gating layer is grown on the lower electrodes by means of self-alignment technique, such that the interlayer leakage channel running through the gating layer is isolated via the insulating dielectric layers; thus leakage between the upper and lower word lines through the gating layer is prevented, solving the technical problem in the prior art of leakage between the upper and lower word lines in a self-gating resistive storage device, and improving the reliability of the device.

Self-gating resistive storage device having resistance transition layer in vertical trench in stacked structure of insulating dielectric layers and electrodes

The present invention discloses a preparation method of a Cu-based resistive random access memory, and a memory. The preparation method includes: performing composition and a chemical combination treatment on a lower copper electrode () to generate a compound buffer layer (), wherein the compound buffer layer () is capable of preventing the oxidation of the lower copper electrode (); depositing a solid electrolyte material () on the compound buffer layer (); and depositing an upper electrode () on the solid electrolyte material () to form the memory. In the above technical solution, the compound buffer layer () capable of preventing the oxidation of the lower copper electrode () is inserted between the lower copper electrode () and the solid electrolyte material () to efficiently prevent the oxidation of the lower copper electrode () in a growth process of the solid electrolyte material (), such that an electrode interface does not become rough due to the oxidation, thereby solving the technical problem of relatively low reliability and yield of the device resulting from the rough electrode interface of the Cu-based resistive random access memory in the prior art, and thus the reliability and the yield of the device are improved.

Preparation method of Cu-based resistive random access memory, and memory

A selector for a bipolar resistive random access memory and a method for fabricating the selector are provided. The method includes: providing a substrate; forming a lower electrode on the substrate, where the lower electrode is made of a metal, and the metal is made up of metal atoms which diffuse under an annealing condition of below 400&#xb0; C.; forming a first metal oxide layer on the lower electrode; performing an annealing process on the first metal oxide layer to make the metal atoms in the lower electrode diffuse into the first metal oxide layer to form a first metal oxide layer doped with metal atoms; forming a second metal oxide layer on the first metal oxide layer doped with metal atoms; forming an upper electrode layer on the second metal oxide layer; and patterning the upper electrode layer to form an upper electrode.

Selection device for use in bipolar resistive memory and manufacturing method therefor

The present disclosure discloses a self-gated RRAM cell and a manufacturing method thereof; which belong to the field of microelectronic technology. The self-gated RRAM cell comprises: a stacked structure containing multiple layers of conductive lower electrodes; a vertical trench formed by etching the stacked structure; a MXYgated layer formed on an inner wall and a bottom of the vertical trench; a resistance transition layer formed on a surface of the MXY, gated layer; and a conductive upper electrode formed on a surface of the resistance transition layer, the vertical trench being filled with the conductive upper electrode. The present disclosure is implemented on a basis of using the self-gated RRAM as a memory cell. It may not depend on a gated transistor and a diode, but relies on a non-linear variation characteristic of resistance of its own varied with voltage to achieve a self-gated function, which has a simple structure, easy integration, high density and low cost, capable of suppressing a reading crosstalk phenomenon in a cross array structure; and is also adapted for a planar stacked cross array structure and a vertical cross array structure, achieving 3D storage with a high density.

Self-gated RRAM cell and method for manufacturing the same

A method for evaluating the thermal effects of 3D RRAM arrays and reducing thermal crosstalk, including the following steps: Step 1: calculating the temperature distribution in the array through 3D Fourier heat conduction equation; Step 2, selecting a heat transfer mode; Step 3, selecting an appropriate array structure; Step 4, analyzing the effect of position of programming device in the array on the temperature; Step 5, analyzing the thermal crosstalk effect in the array; Step 6, evaluating thermal effects and thermal crosstalk; Step 7, changing the array structure or modify operating parameters based on the evaluation results to reduce the thermal crosstalk. According to the method of the present invention, the influence of the position of the device on the temperature is analyzed according to the heat transfer mode of the 3D RRAM array, the thermal effect and the thermal crosstalk are evaluated, and the appropriate array structure and operating parameters are selected according to the evaluation result, which effectively improves the thermal stability of the device.

Method for evaluating thermal effect and reducing thermal crosstalk of three-dimensional integrated resistive switching memory

A nonvolatile resistive switching memory includes an inert metal electrode, a resistive switching functional layer, and an easily oxidizable metal electrode. A graphene intercalation layer with nanopores, interposed between the easily oxidizable metal electrode and the resistive switching functional layer, is capable of controlling the metal ions, which are formed by the oxidation of the easily oxidizable metal electrode during the programming of the device, and only enter into the resistive switching functional layer through the position of the nanopores. Further, the graphene intercalation layer with nanopores is capable of blocking the diffusion of the metal ions, making the metal ions, which are formed after the oxidation of the easily oxidizable metal electrode, enter into the resistive switching functional layer only through the position of the nanopores during the programming of the device, thereby controlling the growing position of conductive filament.

Manufacturing method for a nonvolatile resistive switching memory device

The present invention discloses a preparation method of a Cu-based resistive random access memory, and a memory. The preparation method includes: forming a copper wire in a groove through a Damascus copper interconnection process, wherein the copper wire includes a lower copper electrode for growing a storage medium, and the copper wire is arranged above a first capping layer; forming a second capping layer above the copper wire; forming a hole at a position corresponding to the lower copper electrode on the second capping layer, wherein the pore is used for exposing the lower copper electrode; performing composition and a chemical combination treatment on the lower copper electrode to generate a compound barrier layer, wherein the compound barrier layer is a compound formed by the chemical combination of elements Cu, Si and N, or a compound formed by the chemical combination of elements Cu, Ge and N; and depositing a solid electrolyte material and an upper electrode on the compound barrier layer. By means of the above technical solution, the technical problem of higher injection efficiency of Cu ions in the Cu-based resistive random access memory in the prior art is solved, and the fatigue properties of the memory are improved.

Preparation method of Cu-based resistive random access memory

There is provided a three-terminal atomic switching device and a method of manufacturing the same, which belongs to the field of microelectronics manufacturing and memory technology. The three-terminal atomic switching device includes: a stack structure including a source terminal and a drain terminal; a vertical trench formed by etching the stack structure; an MXYchannel layer formed on an inner wall and a bottom of the vertical trench; and a control terminal formed on a surface of the MXYchannel layer, wherein the control terminal fills the vertical trench. The source terminal resistance and the drain terminal resistance are controlled by the control terminal. The invention is based on the three-terminal atomic switching device, and realizes high switching ratio characteristic, simple structure, easy integration, high density and low cost due to high non-linearity of the source-drain resistance with respect to the control terminal voltage, and thus can be used in a gated device in a cross-array structure to inhibit a crosstalk phenomenon caused by the leakage current. The three-terminal atomic switching device proposed by the invention is suitable for a planar stacked cross-array structure and a vertical cross-array structure, so as to realize high-density three-dimensional storage.

Three-terminal atomic switching device and method of manufacturing the same

A nonvolatile resistive switching memory, comprising an inert metal electrode, a resistive switching functional layer, and an easily oxidizable metal electrode, and characterized in that: a graphene barrier layer is inserted between the inert metal electrode and the resistive switching functional layer, which is capable of preventing the easily oxidizable metal ions from migrating into the inert metal electrode through the resistive switching functional layer under the action of electric field during the programming of the device. The manufacturing method therefore comprises adding a monolayer or multilayer graphene thin film between the inert electrode and the solid-state electrolyte resistive switching functional layer which services as a metal ion barrier layer to stop electrically-conductive metal filaments formed in the resistive switching layer from diffusing into the inert electrode layer during a RRAM device programming process, eliminating erroneous programming phenomenon occurring during the erasing process, improving device reliability.

Nonvolatile resistive switching memory device and manufacturing method thereof

The present disclosure relates to the technical field of information data storage and processing. There is provided a method for regulating magnetic multi-domain state, comprising: when a current is applied to a magnetic thin film, applying an additional external magnetic field having a magnetic field strength of 0 to 4&#xd7;105 A/m to regulate magnetization state of the magnetic thin film; wherein the current is configured to drive movements of a magnetic domain of the magnetic multi-domain states in the magnetic thin film, and the external magnetic field is configured to regulate generation of new magnetic domain in the magnetic thin film and state of the magnetic domain during the movement, so that the magnetic thin film is in a stable magnetic multi-domain state. Such a multi-domain state can't be affected by a higher or lower current and keeps stable when the current is removed. Such a method may be used for magnetic memory or spin-logic device to implement a nonvolatile multi-valued storage, multi-bits logic operation, or neuromorphic computing.

Method for controlling magnetic multi-domain state

A gating device cell for a cross array of bipolar resistive memory cells comprises an n-p diode and a p-n diode, wherein the n-p diode and the p-n diode have opposite polarities and are connected in parallel, such that the gating device cell exhibits a bidirectional rectification feature. The gating device cell exhibits the bidirectional rectification feature, that is, it can provide a relatively high current density at any voltage polarity in its ON state, and also a relatively great rectification ratio (R/R) under a read voltage. Therefore, it is possible to suppress read crosstalk in the cross array of bipolar resistive memory cells to avoid misreading, thereby solving the problem that a conventional rectifier diode is only applicable to a cross array of unipolar resistive memory cells.

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Beijing, China

Shibing Long