Csmc Technologies Fab1 Co., Ltd.

Csmc Technologies Fab2 Co., Ltd.

Shengrong Zhong

Xiaoshe Deng

Dongfei Zhou

Genyi Wang

An insulated gate bipolar transistor () is provided. A substrate () of the insulated gate bipolar transistor () is of an N type. A P-type region () is disposed on a back of the N-type substrate. A back metal structure () is disposed on a back of the P-type region (). A terminal protection ring is disposed in a terminal structure. A polysilicon gate () is disposed on a front surface of the substrate () in an active region. Sidewalls () are disposed at two sides of the polysilicon gate () on the substrate (). An interlayer medium () covered with the polysilicon gate () and the sidewalls () is disposed on the substrate (). The interlayer medium () is covered with a metal lead wire layer (). An N-type carrier enhancement region () is disposed in the substrate () in the active region. A P-type body region () is disposed in the carrier enhancement region (). An N-type heavily doped region () is disposed in the P-type body region (). A P-type heavily doped region () is disposed in the N-type heavily doped region (). An inward recessed shallow pit () with a depth of 0.15 to 0.3 micrometers is formed on a surface of the P-type heavily doped region (). By disposing the carrier enhancement region (), the carrier concentration of a channel can be increased and a forward voltage drop can be reduced; in addition, the shallow pit () can make a device obtain good impurity distribution and a large metal contact area, thereby improving the performance of the device.

Insulated gate bipolar transistor and manufacturing method therefor

A semiconductor rectifying device includes a substrate of a first conductivity type, an epitaxial layer of the first conductivity type, a filling structure, an upper electrode, a guard ring, and a guard layer. The epitaxial layer defines a plurality of trenches thereon. The filling structure includes an insulating material formed on the inner surface of the trench and a conductive material filled in the trench. A doped region of a second conductivity type is formed in the surface of the epitaxial layer between the filling structures. A method of manufacturing a semiconductor rectifying device includes forming an epitaxial layer of a first conductivity type on a substrate of the first conductivity type, defining a plurality of trenches on the epitaxial layer, forming a plurality of filling structures in the plurality of trenches, and forming a doped region in the epitaxial layer between the filling structures.

Semiconductor rectifier and manufacturing method thereof

An insulated gate bipolar transistor and a manufacturing method therefor. The insulated gate bipolar transistor comprises a semiconductor substrate () of a first conductive type, which is provided with a first major surface (S) and a second major surface (S), wherein the semiconductor substrate () comprises a primitive cell area () and a terminal protection area () which is located outside the primitive cell area; a first semiconductor layer () of a first conductive type which is formed at the side of the first major surface of the semiconductor substrate (), wherein the doping concentration of the first semiconductor layer () is higher than the doping concentration of the semiconductor substrate (); and an insulated gate transistor unit which is formed at the side of the first major surface of the first semiconductor layer () in the primitive cell area, wherein the insulated gate transistor unit is conducted, a channel of a first conductive type is formed. Compared with the prior art, the present invention not only can improve the voltage resistance reliability of the insulted gate bipolar transistor, but also can reduce the forward conductive voltage drop of the insulated gate bipolar transistor.

A method for manufacturing an insulated gate bipolar transistor () comprises: providing a substrate (), forming a field oxide layer () on a front surface of the substrate (), and forming a terminal protection ring (); performing photoetching and etching on the active region field oxide layer () by using an active region photomask, introducing N-type ions into the substrate () by using a photoresist as a mask film; depositing and forming a polysilicon gate () on the etched substrate () of the field oxide layer (), and forming a protection layer on the polysilicon gate (); performing junction pushing on an introduction region of the N-type ions, and then forming a carrier enhancement region (); performing photoetching by using a P well photomask, introducing P-type ions into the carrier enhancement region (), and performing junction pushing and then forming a P-body region; performing, by means of the polysilicon gate, self-alignment introduction of N-type ions into the P-body region, and performing junction pushing and then forming an N-type heavily doped region; forming sidewalls on two sides of the polysilicon gate, introducing P-type ions into the N-type heavily doped region, and performing junction pushing and then forming a P-type heavily doped region; and removing the protection layer, and then performing introduction and doping of the polysilicon gate. The method reduces a forward voltage drop disposing the carrier enhancement region.

Method for manufacturing insulated gate bipolar transistor

A preparation method for a power diode, comprising: providing a substrate (), the substrate () having a front surface and a back surface opposite to the front surface, an N-type layer () growing on the front surface of the substrate (), and the N-type layer () having a first surface deviating from the substrate (); forming a terminal protection ring (); forming an oxide layer (), and performing knot pushing on the terminal protection ring (); conducting photoetching using a photoetching plate of an active region and etching the oxidation layer () of the active region, and forming a gate oxide layer () on the first surface of the N-type layer () of the active region; depositing on the gate oxide layer () to form a polysilicon layer (); conducting photoetching using a polysilicon photoetching plate, taking a photoresist () as a mask layer to inject P-type ions into the N-type layer (), and forming a P-type body region () beneath the polysilicon layer () through ion scattering; forming an N-type heavily doped region; forming a P+region; conducting thermal annealing, activating injected impurities and removing the photoresist (); and conducting metallization processing on the first surface and the back surface of the substrate ().

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Wuxi New District, China

Shengrong Zhong