Lam Research Corporation

Shen Peng

Andras Kuthi

Dan A Marohl

Tamarak Pandhumsoporn

Oscar Lopez

Jimmy Nguyen

Craig Rosslee

David Setton

Anthony Nguyen

Daniel Marohl

A substrate processing system includes a processing chamber including a dielectric window and a substrate support arranged therein to support a substrate. A coil is arranged outside of the processing chamber adjacent to the dielectric window. A Faraday shield is arranged between the coil and the dielectric window. An RF generator is configured to supply RF power to the coil. The coil is coupled by stray capacitance and/or directly coupled to the Faraday shield. A capacitor is connected to one of the coil and the Faraday shield to adjust a position of a voltage standing wave along the coil.

Substrate processing system including coil with RF powered faraday shield

A coil portion is formed. A first articulation portion extends from the coil portion. A first mounting structure extends from the first articulation portion. The first mounting structure includes a first mounting region configured to mount in contact with a terminal of a first electrical component. The first articulation portion and the first mounting structure are configured to position the first mounting region at a location outside of a strong electromagnetic field emanating from the coil portion. A second articulation portion extends from the coil portion. A second mounting structure extends from the second articulation portion. The second mounting structure includes a second mounting region configured to mount in contact with a terminal of a second electrical component. The second articulation portion and the second mounting structure are configured to position the second mounting region at a location outside of the strong electromagnetic field emanating from the coil portion.

Articulated direct-mount inductor and associated systems and methods

A first inductive loop is formed within a printed circuit board (PCB). The PCB is mounted in a fixed spatial relationship with a radiofrequency power supply structure. A second inductive loop is formed within the PCB. The second inductive loop is positioned in fixed spatial relationship with the first inductive loop such that a distance between the centerpoints of the first and second inductive loops has a fixed value and is precisely known. Each of the first and second inductive loops is formed in an essentially identical manner with regard to number of complete turns of the loops and a size of the loops. A first voltage signal present on the first inductive loop and a second voltage signal present on the second inductive loop and the distance between the first and second loops provide for determination of a radiofrequency current present on the radiofrequency power supply structure.

Inductive current sensor on printed circuit board

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Dublin, CA, United States of America

Shen Peng