Shanghai Micro Electronics Equipment (group) Co., Ltd.

Shanghai Micro Electronics Equipment Co., Ltd.

Shaoyu Wang

Gang Wang

Jie Jiang

Jiaozeng Zheng

Dong Ruan

Cuixia Tian

Yunbin Pu

Disclosed in this invention is a wafer processing apparatus and method for pre-alignment and edge exposure of a wafer. The wafer processing apparatus includes a pre-alignment module, an edge exposure module, a motion module, a control module and a rotary table. The motion module includes a rotation module, a lifting module and a translation module, which are disposed and interconnected above one another. The rotation module is connected at the top to the rotary table and is configured to drive the rotary table to rotate together with the wafer. The lifting module is configured to drive the rotation module and the rotary table to move vertically. The translation module is configured to drive the lifting module and the rotation module to move horizontally. The pre-alignment module and the edge exposure module are positioned in correspondence to opposing sides of the wafer. The invention reduces the number of objects to be controlled as well as the complexity in control and system structure. Additionally, it simplifies the pre-alignment operation and reduces equipment cost.

Wafer processing device and method therefor

An apparatus for pre-aligning a wafer comprises: a wafer stage for carrying the wafer, wherein a first alignment mark (W1) and a second alignment mark (W2) are arranged on the wafer such that they are substantially symmetrical to each other with respect to a center of the wafer; a peripheral vision acquisition system (), configured to perform a first positional compensation for the wafer based on a relative positional relationship of an edge or a notch of the wafer with respect to the wafer stage; and a mark detection system (), configured to capture images of the first and second alignment marks (W1, W2) and perform a second positional compensation for the wafer by determining a relative positional relationship of the center of the wafer with respect to a center of the wafer stage based on the positions of the first and second alignment marks (W1, W2) in a coordinate system of the mark detection system, wherein the coordinate system of the mark detection system () has a horizontal axis (X) defined by a line passing through the center of the wafer stage and a center of the mark detection system () and a vertical axis (Y) defined by a line crossing the horizontal axis (X) at right angles and passing through the center of the wafer stage.

Pre-alignment device and method for wafer

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Shanghai, China

Shaoyu Wang