Taiwan Semiconductor Manufacturing Comp. Ltd.

Industrial Technology Research Institute

Shang-Wen Chang

Yi-Hsun Chiu

Yi-Hsiung Lin

Ching-Wei Tsai

Chih-Hao Wang

Cheng-Chi Chuang

Chih-Liang Chen

Hui-Zhong Zhuang

Yu-Xuan Huang

Chi-Yu Lu

Min Cao

Chih-Yu Lai

Shang-Syuan Ciou

Kuo-Cheng Chiang

Kuan-Ting Pan

Guo-Huei Wu

Kuan-Lun Cheng

Huan-Chieh Su

Pei-Yu Wang

Li-Chun Tien

Li-Zhen Yu

Chun-Yuan Chen

Kuei Shun Chen

Chih-Chao Chou

George Liu

Vencent Chang

Ru-Gun Liu

Chih-Ming Lai

Chung-Cheng Wu

Shi-Ning Ju

Cheng-Ting Chung

Kuan-lun Cheng

Yi-Chun Wong

Guo-Yung Chen

Ming-Dar Wei

A semiconductor device includes a substrate. The semiconductor device further includes a first gate structure on a first side of the substrate. The semiconductor device further includes a second gate structure on a second side of the substrate, wherein the first side is opposite the second side. The semiconductor device further includes a gate via extending through the substrate, wherein the gate via directly connects to the first gate structure, and the gate via directly connects to the second gate structure.

Method of making amphi-FET structure and method of designing

A method and structure for forming a local interconnect, without routing the local interconnect through an overlying metal layer. In various embodiments, a first dielectric layer is formed over a gate stack of at least one device and a second dielectric layer is formed over a contact metal layer of the at least one device. In various embodiments, a selective etching process is performed to remove the second dielectric layer and expose the contact metal layer, without substantial removal of the first dielectric layer. In some examples, a metal VIA layer is deposited over the at least one device. The metal VIA layer contacts the contact metal layer and provides a local interconnect structure. In some embodiments, a multi-level interconnect network overlying the local interconnect structure is formed.

Interconnect structure and methods thereof

Methods of forming dual-side super power rails in semiconductor devices, semiconductor devices including the same, and methods of testing the semiconductor devices are disclosed. In an embodiment, a device includes a transistor structure; a front-side interconnect structure on a front side of the transistor structure; and a back-side interconnect structure on a back side of the transistor structure. The front-side interconnect structure includes a front-side power delivery network (PDN) and a front-side input/output (I/O) pin. The back-side interconnect structure includes a back-side PDN.

Dual-side power rail design and method of making same

An integrated circuit (IC) includes a first p-type semiconductor fin, a first dielectric fin, a first hybrid fin, a second hybrid fin, a second dielectric fin, and a second p-type semiconductor fin disposed in this order along a first direction and oriented lengthwise along a second direction, where each of the first and the second hybrid fins has a first portion including an n-type semiconductor material and a second portion including a dielectric material. The IC further includes n-type source/drain (S/D) epitaxial features disposed over each of the first and the second p-type semiconductor fins, p-type S/D epitaxial features disposed over the first portion of each of the first and the second hybrid fins, and S/D contacts physically contacting each of the p-type S/D epitaxial features and the second portion of each of the first and the second hybrid fins.

FinFET SRAM cells with reduced fin pitch

A semiconductor device structure is provided. The semiconductor device structure includes a first epitaxial structure and a second epitaxial structure spaced apart from the first epitaxial structure. The semiconductor device structure also includes a conductive contact electrically connected to the first epitaxial structure and a first conductive via over the conductive contact. The semiconductor device structure further includes a second conductive via directly above the second epitaxial structure. The second conductive via is longer than the first conductive via.

Semiconductor device with contact structures

A semiconductor structure includes a first semiconductor fin and a second semiconductor fin adjacent to the first semiconductor fin. The first and the second semiconductor fins extend lengthwise along a first direction over a substrate. A metal gate structure is disposed over the first and second semiconductor fins, the metal gate structure extending lengthwise along a second direction perpendicular to the first direction. A first epitaxial source/drain (S/D) feature is disposed over the first semiconductor fin, and a second epitaxial S/D feature is disposed over the second semiconductor fin. An interlayer dielectric (ILD) layer is disposed over the first and the second epitaxial S/D features. And an S/D contact is disposed directly above the first and second epitaxial S/D features. The S/D contact directly contacts the first epitaxial S/D feature, and the S/D contact is isolated from the second epitaxial S/D feature by the ILD layer.

Methods of forming contact features in field-effect transistors

A method of making a semiconductor device includes manufacturing a first transistor over a first side of a substrate. The method further includes depositing a spacer material against a sidewall of the first transistor. The method further includes recessing the spacer material to expose a first portion of the sidewall of the first transistor. The method further includes manufacturing a first electrical connection to the transistor, a first portion of the electrical connection contacts a surface of the first transistor farthest from the substrate, and a second portion of the electrical connect contacts the first portion of the sidewall of the first transistor. The method further includes manufacturing a self-aligned interconnect structure (SIS) extending along the spacer material, wherein the spacer material separates a portion of the SIS from the first transistor, and the first electrical connection directly contacts the SIS.

Method of making semiconductor device having self-aligned interconnect structure

Semiconductor devices and methods are provided which facilitate performing physical failure analysis (PFA) testing from a backside of the devices. In at least one example, a device is provided that includes a semiconductor device layer including a plurality of diffusion regions. A first interconnection structure is disposed on a first side of the semiconductor device layer, and the first interconnection structure includes at least one electrical contact. A second interconnection structure is disposed on a second side of the semiconductor device layer, and the second interconnection structure includes a plurality of backside power rails. Each of the backside power rails at least partially overlaps a respective diffusion region of the plurality of diffusion regions and defines openings which expose portions of the respective diffusion region at the second side of the semiconductor device layer.

Backside power rail for physical failure analysis (PFA)

A semiconductor device structure, along with methods of forming such, are described. The structure includes a first and second gate electrode layers, and a dielectric feature disposed between the first and second gate electrode layers. The dielectric feature has a first surface. The structure further includes a first conductive layer disposed on the first gate electrode layer. The first conductive layer has a second surface. The structure further includes a second conductive layer disposed on the second gate electrode layer. The second conductive layer has a third surface, and the first, second, and third surfaces are coplanar. The structure further includes a third conductive layer disposed over the first conductive layer, a fourth conductive layer disposed over the second conductive layer, and a dielectric layer disposed on the first surface of the dielectric feature. The dielectric layer is disposed between the third conductive layer and the fourth conductive layer.

FinFET device structure having dielectric features between a plurality of gate electrodes and methods of forming the same

The disclosed circuit includes a first and a second active region (AR) spaced a spacing S along a direction in a first standard cell (SC) that spans Dalong the direction between a first and a second cell edge (CE). Each of the first and second ARs spans a first width Walong the direction; a third and a fourth AR spaced S in a second SC that spans a second dimension Dalong the direction between a third and a fourth CE; and gate stacks extend from the fourth CE of the second SC to the first CE of the first SC, wherein D<D; each of the third and fourth ARs spans a second width Walong the direction; W<W; and the third CE is aligned with and contacts the second CE. The first and second ARs have a structure different from the third and fourth ARs.

Integrated hybrid standard cell structure with gate-all-around device

A device includes a first semiconductor strip and a second semiconductor strip extending longitudinally in a first direction, where the first semiconductor strip and the second semiconductor strip are spaced apart from each other in a second direction. The device also includes a power supply line located between the first semiconductor strip and the second semiconductor strip. A top surface of the power supply line is recessed in comparison to a top surface of the first semiconductor strip. A source feature is disposed on a source region of the first semiconductor strip, and a source contact electrically couples the source feature to the power supply line. The source contact includes a lateral portion contacting a top surface of the source feature, and a vertical portion extending along a sidewall of the source feature towards the power supply line to physically contact the power supply line.

Integrated circuit device including a power supply line and method of forming the same

A method for forming a fin field effect transistor device structure is provided. The method includes forming a first spacer layer over a first fin structure and a second fin structure. The method also includes forming a power rail between the first fin structure and the second fin structure. The method further includes forming a second spacer layer over the first spacer layer and the power rail. In addition, the method includes forming a fin isolation structure over the power rail between the first fin structure and the second fin structure. The method also includes forming an epitaxial structure over the first fin structure and the second fin structure. The method further includes forming an inter-layer dielectric structure covering the epitaxial structure. In addition, the method includes forming an opening exposing the epitaxial structure, the power rail and the fin isolation structure. The method also includes filling the opening with a first contact structure.

Method for forming fin field effect transistor device structure

Methods of performing backside etching processes on source/drain regions and gate structures of semiconductor devices and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first transistor structure; a first interconnect structure on a front-side of the first transistor structure; and a second interconnect structure on a backside of the first transistor structure, the second interconnect structure including a first dielectric layer on the backside of the first transistor structure; a contact extending through the first dielectric layer to a source/drain region of the first transistor structure; and first spacers along sidewalls of the contact between the contact and the first dielectric layer, sidewalls of the first spacers facing the first dielectric layer being aligned with sidewalls of the source/drain region of the first transistor structure.

Self-aligned etch in semiconductor devices

A semiconductor device includes a first gate structure extending along a first lateral direction. The semiconductor device includes a first interconnect structure, disposed above the first gate structure, that extends along a second lateral direction perpendicular to the first lateral direction. The first interconnect structure includes a first portion and a second portion electrically isolated from each other by a first dielectric structure. The semiconductor device includes a second interconnect structure, disposed between the first gate structure and the first interconnect structure, that electrically couples the first gate structure to the first portion of the first interconnect structure. The second interconnect structure includes a recessed portion that is substantially aligned with the first gate structure and the dielectric structure along a vertical direction.

Semiconductor device including recessed interconnect structure

A semiconductor device includes a base isolation layer, a first transistor with a first source electrode at a first side of the base isolation layer. A bridge pillar extends through the base isolation layer, and a metal electrode electrically connects the bridge pillar to the first source electrode. The metal electrode and the first source electrode are at the same side of the base isolation layer. A second metal electrode at an opposite side of the base isolation layer electrically connects to the bridge pillar and to a conductive line at the second side of the base isolation layer.

Growing community of inventors

Jhubei, Taiwan

Shang-Wen Chang