Intel Corporation

Xerox Corporation

Tokyo Ohka Kogyo Co., Ltd.

Shan Christopher Clark

Gary Alan Kneezel

Ram S Narang

Robert P Meagley

Almon P Fisher

Bidan Zhang

Ernisse S Putna

James S Clarke

Thomas W Smith

Michael D Goodner

Kazumasa Wakiya

Makarem A Hussein

Wang Yueh

Michael L McSwiney

Vijayakumar S Ramachandrarao

Takayuki Haraguchi

Shigeru Yokoi

Robert B Turkot, Jr

Michael J Leeson

Lana Jong

Bob E Leet

Kim-Khanh Ho

Kazumasa c/o Tokyo Ohka Kogyo Co Ltd Wakiya

Lana I Jong

Shigeru c/o Tokyo Ohka Kogyo Co Ltd Yokoi

Takayuki c/o Tokyo Ohka Kogyo Co Ltd Haraguchi

Supercritical carbon dioxide may be utilized to remove resistant residues such as those residues left when etching dielectrics in fluorine-based plasma gases. The supercritical carbon dioxide may include an oxidizer in one embodiment.

Cleaning residues from semiconductor structures

A cleaning composition comprises at least quaternary ammonium hydroxide, a water-soluble organic solvent, water, an anticorrosive, and potassium hydroxide of 1 mass percent or less of a total amount of the solution. This cleaning composition can singly and effectively remove a photoresist film, a buried material, a metallic residue from the surface of a semiconductor substrate.

Cleaning composition and method of cleaning semiconductor substrate

Anti-reflective materials such as bottom anti-reflective coatings (BARC's) and sacrificial light absorbing materials (SLAM) may be made more effective at preventing coherent light or electron beam reflection from a substrate by including in the anti-reflective material an additive to alter the radiation beam path of the reflected light or electrons. The radiation beam path altering additive may be a reflective material or a refractive material. The inclusion of such a radiation beam bath altering additive may reduce line width roughness and increase critical dimension (CD) control of interconnect lines and vias.

Anti-reflective coatings

Disclosed is a process for forming a channel wafer for a novel ink jet printhead, having an ink particle-filter layer over the ink-inlet surface thereof. The process includes the steps of applying a thin coating of a heat-curable, photopatternable polymer composition to an intermediate substrate having a release surface and drying the coating to form a semi-solid adhesive layer. The layer and supporting substrate are pressed against the ink-inlet surface of a channel wafer with an optional adhesive layer to bond the layer to the ink inlet surface. The substrate is separated to transfer the contacting area of the semi-solid layer to the ink-inlet surface as a laminate, and the semi-solid layer is exposed through a filter-forming mask and ink particle-filter openings are developed therethrough, either before or after transfer of the semi-solid adhesive layer from the intermediate substrate to the ink-inlet surface of the channel wafer, and the filter layer is cured.

Formation of novel ink jet filter printhead using transferable photopatterned filter layer

A basic developer/quencher solution formulated to include at least one supercritical fluid or liquid solvent and a base may be used to quench a photo-generated acid within a photoresist as well as develop the photoresist. The supercritical fluid or liquid solvent may be carbon dioxide and the base may be quaternary ammonium salt that has side groups that increase the solubility of the quaternary ammonium salt in carbon dioxide.

Basic quencher/developer solutions for photoresists

Multiple-layer films in integrated circuit processing may be formed by the phase segregation of a single composition formed above a semiconductor substrate. The composition is then induced to phase segregate into at least a first continuous phase and a second continuous phase. The composition may be formed of two or more components that phase segregate into different continuous layers. The composition may also be a single component that breaks down upon activation into two or more components that phase segregate into different continuous layers. Phase segregation may be used to form, for example, a sacrificial light absorbing material (SLAM) and a developer resistant skin, a dielectric layer and a hard mask, a photoresist and an anti-reflective coating (ARC), a stress buffer coating and a protective layer on a substrate package, and light interference layers.

Layered films formed by controlled phase segregation

Disclosed is a process for forming a channel wafer for a novel ink jet printhead, having an ink particle-filter layer over the ink-inlet surface thereof. The process comprises the steps of applying a thin coating of a heat-curable, photopatternable polymer composition to an intermediate substrate having a release surface and drying the coating to form a semi-solid adhesive layer. The layer and supporting substrate are pressed against the ink-inlet surface of a channel wafer with an optional adhesive layer to bond the layer to the ink inlet surface. The substrate is separated to transfer the contacting area of the semi-solid layer to the ink-inlet surface as a laminate, and the semi-solid layer is exposed through a filter-forming mask and ink particle-filter openings are developed therethrough, either before or after transfer of the semi-solid adhesive layer from the intermediate substrate to the ink-inlet surface of the channel wafer, and the filter layer is cured.

Disclosed is a process for forming a novel ink jet printhead which comprises: (a) providing a lower substrate in which one surface thereof has an array of drop generating elements and addressing electrodes formed thereon; (b) depositing onto the release surface of an intermediate film support a photopatternable layer comprising a precursor polymer which is a phenolic novolac resin having glycidyl ether functional groups; (c) prebaking the photopatternable layer to dry, semi-solid condition; (d) laminating the dry, semi-solid layer to the surface of the lower substrate under heat and pressure and separating it from the release surface of the intermediate film support; (e) exposing the photopatternable layer to actinic radiation in an imagewise pattern corresponding to ink nozzles and developing to form a nozzle plate section, and (f) removing the precursor polymer from the unexposed areas, thereby forming ink nozzle recesses which are aligned to communicate with the drop generating elements and terminal ends of the electrodes of the lower substrate laminated thereto. Step (e) may be carried out either before or after step (d).

Formation of photopatterned ink jet nozzle plates by transfer methods

A thermal ink jet printhead having an upper substrate and a lower substrate in which one surface thereof has an array of heating elements and addressing electrodes formed thereon. The lower substrate has an insulative layer deposited on the surface thereof and over the heating elements and addressing electrodes and patterned to form recesses therethrough to expose the heating elements and terminal ends of the addressing electrodes. The upper and lower substrates are bonded together to form a thermal ink jet printhead having droplet emitting nozzles defined by the upper substrate, the insulative layer on the lower substrate, and the heating elements in the lower substrate. At least one of the upper substrate and the insulative layer comprises a crosslinked polymer formed by crosslinking a precursor polymer which is a phenolic novolac resin having glycidyl ether functional groups on the monomer repeat units thereof.

Thermal ink jet printhead with crosslinked polymer layer

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Forest Grove, OR, United States of America

Shan Christopher Clark