Samsung Electronics Co., Ltd.

Seoul National University

Fairchild Korea Semiconductor Ltd.

Seok Heo

Hyun Woo Kim

Yong Suk Choi

Sungyong Park

Yong Won Choi

Sang Joon Hong

Moonsik Song

Kyung-Won Kang

Cha Won Koh

Young Il Jang

Kyung Won Seo

Sungjin Kim

Hyunwoo Kim

Sunghwan Kim

Dongwook Kim

Sang Ho Lee

Dong-wook Kim

Jin Woo Lee

Jae Hong Lee

Sun Ho Kim

Dong-Wook Kim

Ho-Young Kim

Yoon Young Kim

Jieun Yang

Ju Hyung Lee

Taemin Earmme

Sun-Ho Kim

Chawon Koh

Junyoung Lee

Yi Jin

Ansook Sul

Wonguk Seo

Ki-Hoon Nam

Jae-Chul Hwang

Chang Gi Min

Kyoung Whan Oh

Hyungjong Kim

JaeChul Hwang

Juno Park

Yinghu Xu

Jong Hwi Seo

Jae Won Jeong

Jaekyung Park

Hongju Kim

Takashi Sasa

Chaemook Lim

Eunseok Seo

Gui Hyun Cho

Hyeongseok Jo

Yun Jong Choi

Chaehung Lim

Ho Kyun Kim

Euijin Kim

Hyunwoong Hwang

Dong-il Yoon

Tae-Min Earmme

Youngho Hwang

A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.

Substrate processing apparatus and method of fabricating semiconductor device using the same

A substrate processing apparatus includes a substrate support configured to support and rotate a substrate, at least one first lower cleaning nozzle configured to spray a first cleaning liquid on a lower surface of the substrate, at least one second lower cleaning nozzle configured to spray a second cleaning liquid on the lower surface of the substrate, a bowl assembly disposed around the substrate support, the bowl assembly including a cup body providing an annular shaped accommodating space and inner and outer collection portions sequentially arranged in a radial direction in a lower portion of the cup body, an annular shaped discharge guide plate disposed in the receiving space of the bowl assembly under the substrate and extending outwardly from a circumference of the substrate, and a discharge separation plate provided within the receiving space of the bowl assembly to be movable upward and downward.

Substrate processing apparatus and substrate processing method

A photoresist supplying system includes a pump that includes a first tube phragm that stores a photoresist and a filter that filters the photoresist, a second tube phragm that stores the photoresist and is disposed outside the pump, where the second tube phragm transfers the photoresist to the first tube phragm, a storage unit that stores the photoresist, where the storage unit provides the photoresist to the second tube phragm, and a tube phragm drive unit that is connected to the first tube phragm. The tube phragm drive unit adjusts an interior volume of the first tube phragm and applies a pressure to a flexible outer wall of the first tube phragm to transfer the photoresist from the first tube phragm to a nozzle installed in the chamber. At least a part of the photoresist stored in the first tube phragm is transferred to the second tube phragm.

System for supplying photoresist and method for fabricating semiconductor device using the same

In a method of coating a photoresist, the photoresist may be provided to an upper surface of a rotating wafer. A hovering solution may be injected to an edge portion of the photoresist under a condition that the hovering solution may be hovered with respect to the edge portion of the photoresist with an air layer being interposed between the hovering solution and the edge portion of the photoresist to limit and/or prevent a bead of the photoresist from being formed on an edge portion of the upper surface of the wafer. Thus, the photoresist having a uniform thickness may be coated on the upper surface of the wafer to improve a yield of a semiconductor device by increasing an effective area of the edge portion of the wafer.

Method of coating a photoresist and apparatus for performing the same

A chemical solution vaporization device includes a chemical solution tank including chemical solution vaporization rooms, a chemical solution sensing room, and a chemical solution supply room. A first internal wall separating the plurality of chemical solution vaporization rooms from each other includes a first opening at a lower portion thereof. A second internal wall separating at least one of the plurality of chemical solution vaporization rooms from the chemical solution supply room includes a second opening at a lower portion thereof. A third internal wall separating at least one of the plurality of chemical solution vaporization rooms from the chemical solution sensing room includes a third opening at a lower portion thereof. And a lower portion of a fourth internal wall separating the chemical solution sensing room from the chemical solution supply room is combined with the lower wall.

Chemical solution evaporation device and substrate processing device including the same

A wafer processing apparatus is provided. The apparatus includes: a heating plate through which vacuum ports are formed; a plurality of temperature sensors; a heating device configured to heat the heating plate; first and second power supplies; temperature controllers to generate first and second feedback temperature control signals for controlling power output power supplies based on measurement values generated by the temperature sensors; an electronic pressure regulator configured to provide vacuum pressure for fixing a wafer to the plurality of vacuum ports; and a wafer chucking controller configured to control the electronic pressure regulator, and generate a feedback pressure control signal for controlling the electronic pressure regulator based on the first and second feedback temperature control signals.

Wafer processing apparatus and wafer processing method using the same apparatus

An apparatus for transferring a wafer includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.

Apparatus for transferring wafer, method for transferring wafer using the same with three sensors

Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.

Load cup and chemical mechanical polishing apparatus and method of manufacturing including the same

A method for controlling a semiconductor manufacturing facility includes measuring output change amounts of differential pressure sensors in the facility when pressure conditions change by a number of fans. The fans are then classified into different groups and subgroups and control sequences of the subgroups are determined based on the change amounts. Difference values are then calculated, and a control signal is generated to adjust the rotation speed of the fans.

System and method for controlling semiconductor manufacturing facility, method of manufacturing integrated circuit using the system and method, and method of manufacturing processor using the system and method

A substrate transfer unit includes a rotation body, an arm member, and first and second blades. The arm member is on the rotation body, and the first and second blades are on the arm member. The arm member includes a first arm including a lower link on the rotation body and an upper link connected on one side of the lower link and a second arm including a first portion and a second portion. The first portion has a first pivot on the other side of the upper link and is connected with the first blade at a first height from the first pivot. The second portion is connected with the first portion and with the second blade at a second height, higher than the first height, from the first pivot.

Substrate transfer unit, substrate treating apparatus including the same, and substrate treating method

A link structure includes a first link, a second link having an end that is connected to an end of the first link, a third link having an end that is connected to the end of the first link, and provided on a portion of the second link, a first rotary shaft partially provided in the first link, a first actuator configured to rotate the first link about the first rotary shaft; a second rotary shaft partially provided in the second link, the second rotary shaft being different from the first rotary shaft, and a second actuator configured to rotate the second link about the second rotary shaft, the first and second actuators being provided in the first link.

Link structure

The voltage measuring apparatus is connected to a plurality of battery cells connected to each other in series to measure respective voltages of the battery cells. The voltage measuring apparatus includes a sample/hold amplifier configured to sample and hold positive electrode and negative electrode voltages of the battery cells to generate first and second output voltages, a differential voltage converter configured to generate a battery cell voltage according to a voltage difference between a positive input terminal and a negative input terminal, and a switching unit configured to control the first and second output voltages and connection between the positive input terminal and the negative input terminal so that a polarity of the voltage difference is constant. The sample/hold amplifier electrically insulates the switching unit from the battery cells.

Voltage measuring apparatus and battery management system including the same

Disclosed are a voltage measuring apparatus and a battery management system including the same. The voltage measuring apparatus is connected to a plurality of battery cells connected to each other in series to measure respective voltage of the battery cells. The voltage measuring apparatus includes a first node coupled to one of an positive electrode and a negative electrode of one of a plurality of battery cells as a voltage measuring target, amplifies a voltage difference between the first node and the second node to generate an error voltage, converts the error voltage into a digital signal, and compensates for a polarity of the digital signal.

Provided are a method of designing a rotary thermal actuator and a rotary thermal actuator. The method includes setting the shape of an entire design domain; dividing the entire design domain into a predetermined number of domains which are symmetrical to one another in a rotational direction from the center of the entire design domain; designing the domains using a topology optimization method which uses a driving stage disposed at the center of the entire design domain, an initial shape of thermal expansion members which connect electrodes disposed at outer boundaries of the entire design domain, material properties of the thermal expansion members, and boundary conditions of the domains; and designing the entire design domain such that the designed domains are symmetrical to one another in the rotational direction.

Method of designing rotary thermal actuator and rotary thermal actuator

Growing community of inventors

Hwaseong-si, South Korea

Seok Heo