Avantor Performance Materials, Inc.

Mallinckrodt Baker, Inc.

Seiji Inaoka

A microelectronic photoresist cleaning composition suitable for cleaning multi-metal microelectronic devices and to do so without any substantial or significant galvanic corrosion occurring when there is a subsequent rinsing step employing water.

Gluconic acid containing photoresist cleaning composition for multi-metal device processing

Back end photoresist strippers and cleaning compositions of this invention are provided by amino acid-free, non-aqueous cleaning compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise at least one polar organic solvent, at least one hydroxylated organic amine, and at least one corrosion inhibitor compound with multiple hydroxyl functional groups that is a compound of the formula:T-[(CRR)&#x2014;(CRR)]&#x2014;(CRR)-Twhere at least one of Rand ROH and if one of Rand Ris not OH, it is selected from H, alkyl or alkoxy, m is a whole integer of 1 or greater, Rand Rare selected from H, alkyl or alkoxy, n is 0 or a greater whole positive integer, p is a whole integer of 1 or greater; at least one of Rand Ris OH and if one of Rand Ris not OH, it is selected from H, alkyl or alkoxy, q is a whole integer of 1 or greater; Tand Tare selected from H, alkyl, hydroxyalkyl, polyhydroxyalkyl, aminoalkyl, carbonylalkyl or amide groups or Tand Tmay be connected forming a structure selected from an aliphatic cyclic or fused cyclic structure.

Non-aqueous, non-corrosive microelectronic cleaning compositions

Photoresist strippers and cleaning compositions of this invention are provided by non-aqueous cleaning compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise at least one polar organic solvent, at least one hydroxylated organic amine, and at least one corrosion inhibitor polymer having multiple hydroxyl- or amino-functional groups pendant from the polymer backbone.

Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors

Back end photoresist strippers and residue compositions are provided by non-aqueous compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise a polar organic solvent, a hydroxylated amine, and as a corrosion inhibitor fructose.

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Nazareth, PA, United States of America

Seiji Inaoka