The University of Tokyo

Tokyo Seimitsu Co., Ltd.

Mochida Pharmaceutical Co., Ltd.

Seiichi Ohta

Satoshi Shimizu

Hiroshi Nishimura

Ken Kato

Mitsuko Isaji

Yuichi Ozawa

Yasuhito Iguchi

Norihiro Kokudo

Kunihiko Chiba

Taichi Ito

An adhesion-preventing material having a high adhesion-preventing effect has been demanded. An adhesion-preventing material including a sterilized biocompatible sponge-like laminate, wherein the sponge-like laminate comprises a sponge-like first layer and a sponge-like second layer each of which is at least partially crosslinked with a curing agent and comprises a low-endotoxin alginic acid monovalent metal salt, the alginic acid monovalent metal salt in the first layer has a weight average molecular weight of 10,000 to 2,000,000, the alginic acid monovalent metal salt in the second layer has a weight average molecular weight of 1,000 to 1,000,000, the weight average molecular weights are measured by a GPC-MALS method after a decrosslinking treatment, and the weight average molecular weight of the alginic acid monovalent metal salt in the first layer is higher than that in the second layer.

Adhesion-preventing composition

[Problem] An adhesion-preventing material having a high adhesion-preventing effect has been demanded. [Solution] An adhesion-preventing material including a sterilized biocompatible sponge-like laminate, wherein the sponge-like laminate comprises a sponge-like first layer and a sponge-like second layer each of which is at least partially crosslinked with a curing agent and comprises a low-endotoxin alginic acid monovalent metal salt, the alginic acid monovalent metal salt in the first layer has a weight average molecular weight of 10,000 to 2,000,000, the alginic acid monovalent metal salt in the second layer has a weight average molecular weight of 1,000 to 1,000,000, the weight average molecular weights are measured by a GPC-MALS method after a decrosslinking treatment, and the weight average molecular weight of the alginic acid monovalent metal salt in the first layer is higher than that in the second layer.

A probe device of the present invention measures a position of every chip in a wafer to be inspected to acquire the position as actual measurement data. Then, the probe device calculates a variation amount of an actual measurement position of each chip or a variation amount of a position at which a probe is brought into contact with the each chip of the wafer on the basis of the actual measurement data, and allows a monitor to display a range-of-variation display image that visually displays the variation amount. In the image, a quadrangular area corresponding to the each chip is displayed, and a dot is displayed in each the quadrangular area at a position shifted from a center position thereof in accordance with the variation amount.

Probe device for testing electrical characteristics of semiconductor element

The present invention provides a probe device that includes an alignment utility function. When a user inputs a condition value for a variation amount (variation range) of a contact position at which a probe is in contact with each chip, in a simulation using actual measurement data acquired by measuring a position of each of all chips in one wafer, a range of variation of each chip is calculated by changing a measurement point at which alignment is performed to calculate a setting of optimum measurement points so that the range of variation is equal to or less than the condition value and the number of measurement points is minimum. Then information on the optimum measurement point is provided to the user.

Alignment support device and alignment support method for probe device

Growing community of inventors

Tokyo, Japan

Seiichi Ohta