Conti Temic Microelectronic Gmbh

Sebastian Toelg

Helmut Seidel

Ulrich Prechtel

Peter Knittl

Manfred Weinacht

Konrad Kapser

A micromechanical capacitive acceleration sensor is described for picking up the acceleration of an object in at least one direction. The sensor includes a frame structure (), a sensor inertia mass () made of a wafer and movably mounted relative to the frame structure () about a rotation axis, and a capacitive pick-up unit () for producing at least one capacitive output signal representing the position of the sensor mass () relative to the frame structure (). The sensor inertia mass () has a center of gravity which offset relative to the rotation axis in a direction perpendicularly to a wafer plane for measuring accelerations laterally to the wafer plane. The sensor mass () and the frame structure () are made monolithically of one single crystal silicon wafer. A cover section () forms a common connector plane () for the connection of capacitor electrodes (). Torqueable elements () form an electrically conducting bearing device for the sensor mass ().

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Walluf, Germany

Sebastian Toelg