Intel Corporation

Altera Corporation

Seagate Technology Incorporated

Other

Ess Technology, Inc.

Seagate Technologies, Inc.

Sean R Atsatt

Scott J Weber

Dheeraj R Subbareddy

Ankireddy Nalamalpu

Herman Henry Schmit

Ravi Prakash Gutala

Aravind Raghavendra Dasu

James Loran Ball

Chee Hak Teh

Michael David Hutton

Dana How

Andrew Martyn Draper

Md Altaf Hossain

Kent Orthner

Lai Guan Tang

Kavitha Prasad

Daniel R Mansur

Sharath Raghava

Harsha Gupta

Ilya K Ganusov

Ting Lu

Gary Brian Wallichs

Prafulla Bollampalli Reddy

Jimmie Ray Shaver

Eng Ling Ho

John Chester Masiewicz

William K Weberg

Timothy V Gates

Mahesh A Iyer

Jun Pin Tan

Chin Hai Ang

Jeffrey Alan Miller

Ee Mei Ooi

Chiew Siang Wong

David Samuel Goldman

Pervez Edul Virjee

Mark Hubert Groo

Rob Pelt

Eriko Nurvitadhi

Ashish Gupta

David J Greenhill

Jeffrey Christopher Chromczak

Timothy Allen

Thien Le

Robert L Pelt

Yi Peng

Arun Jangity

Archanna Srinivasan

Eric Innis

Steve Jahnke

William S Jacobs

Mark H Groo

Parivallal Kannan

Steve Tuyen Vu

John Marc Wright

Marvin Mang-Yin Lum

Simon Chong

Aman Gupta

David Goldman

Lean Kim Ong

Samuel Johannes Hedinger

Methods and apparatus for extracting a setting of configuration bits to create an exclusion configuration for providing protection against peek and poke attacks in a multi-tenant usage model of a configurable device is provided. The device may host multiple parties that do not trust each other. Peek and poke attacks are orchestrated by tapping (peeking) and driving (poking) wires associated with other parties. Such attacks may be disabled by excluding the settings of configuration bits that would allow these attacks by other parties. This set of configuration bits that should be excluded for preventing all peek and poke attacks creates the exclusion configuration. Methods are described that disable a particular class of peek and/or poke attacks through the use of partial reconfiguration. Methods and apparatus are described to dynamically detect peek and/or poke attacks.

Integrated circuit with peek and poke protection circuitry for multi-tenant usage model

Systems and methods described herein may relate to data transactions involving a microsector architecture. Control circuitry may organize transactions to and from the microsector architecture to, for example, enable direct addressing transactions as well as batch transactions across multiple microsectors. A data path disposed between programmable logic circuitry of a column of microsectors and a column of row controllers may form a micro-network-on-chip used by a network-on-chip to interface with the programmable logic circuitry.

Debug trace microsectors

Techniques described herein may relate to providing a programmable interconnect network (e.g., a programmable network-on-chip (NOC)). A method may include determining a transmission parameter, bonding one or more channels of an interconnect network based at least in part on the transmission parameter, and power-gating any unused channels after the bonding.

Network-on-chip (NOC) with flexible data width

Micro-network-on-chip and microsector infrastructure

Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.

Modular periphery tile for integrated circuit device

Circuitry is provided that includes programmable fabric with fine-grain routing wires and a separate programmable coarse-grain routing network that provides enhanced bandwidth, low latency, and deterministic routing behavior. The programmable fabric may be implemented on a top die that is stacked on the active interposer die. The programmable coarse-grain routing network and smart memory circuitry may be implemented on an active interposer die. the smart memory circuitry may be configured to perform higher level functions than simple read and write operations. The smart memory circuitry may carry out command based low cycle count operations using a state machine without requiring execution of a program code, complex microcontroller based multicycle operations, and other non-generic microcontroller based smart RAM functions.

Stacked programmable integrated circuitry with smart memory

An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die, such that the programmable logic fabric may include a first region of programmable logic fabric and a second region of programmable logic fabric. The first region of programmable logic fabric is configured to be programmed with a circuit design that operates on a first set of data. The integrated circuit may also include network on chip (NOC) circuitry disposed on a second integrated circuit die, such that the NOC circuitry is configured to communicate data between the first integrated circuit die and the second integrated circuit die.

Embedded network on chip accessible to programmable logic fabric of programmable logic device in multi-dimensional die systems

Systems and methods described herein may relate to providing a dynamically configurable circuitry able to be programed using a microsector granularity. Furthermore, selective partial reconfiguration operations may be performed use write operations to write a new configuration over existing configurations to selectively reprogram a portion of programmable logic. An n-bit data register (e.g., a 1-bit data register) and/or control circuitry receiving data and commands from an access register disposed between portions of programmable logic may enable at least some of the operations described.

Logic fabric based on microsector infrastructure

Systems and methods described herein may relate to providing a dynamically configurable circuitry able to be programed using a microsector granularity. Furthermore, selective partial reconfiguration operations may be performed use write operations to write a new configuration over existing configurations to selectively reprogram a portion of programmable logic. A quasi-delay insensitive (QDI) shift register and/or control circuitry receiving data and commands from an access register disposed between portions of programmable logic may enable at least some of the operations described.

Logic fabric based on microsector infrastructure with data register having scan registers

Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.

An integrated circuit device having separate dies for programmable logic fabric and circuitry to operate the programmable logic fabric are provided. A first integrated circuit die may include field programmable gate array fabric. A second integrated circuit die may be coupled to the first integrated circuit die. The second integrated circuit die may include fabric support circuitry that operates the field programmable gate array fabric of the first integrated circuit die.

Integrated circuit device with separate die for programmable fabric and programmable fabric support circuitry

A programmable logic device verifies that configuration data permissibly programs the programmable logic device. The programmable logic device includes a programmable fabric having partitions to be programmed by the configuration data, a secure device manager that may generate masks based on the configuration data, and a local sector manager. The masks determine that the configuration data is configured to permissibly program the permitted partitions or that the permitted partitions have been permissibly programmed. The local sector manager applies the masks to generate an interleaved result, compares the interleaved result to an expected result, and sends an indication that the configuration data is configured to permissibly program the permitted partitions or permissibly programmed the permitted partitions in response to determining that the interleaved result is the expected result, or sends an alert to stop programming in response to determining that the interleaved result is not the expected result.

On-device bitstream validation

An integrated circuit assembly may include an integrated circuit having a plurality of programmable logic sectors and an interposer circuit positioned adjacent to the integrated circuit. The interposer circuit may include at least one voltage regulator that distributes a voltage to at least one of the plurality of programmable logic sectors and at least one thermal sensor that measures a temperature of the at least one of the plurality of programmable logic sectors.

Systems and methods for integrating power and thermal management in an integrated circuit

A three dimensional circuit system includes first and second integrated circuit (IC) dies. The first IC die includes programmable logic circuits arranged in sectors and first programmable interconnection circuits having first router circuits. The second IC die includes non-programmable circuits arranged in regions and second programmable interconnection circuits having second router circuits. Each of the regions in the second IC die is vertically aligned with at least one of the sectors in the first IC die. Each of the second router circuits is coupled to one of the first router circuits through a vertical die-to-die connection. The first and second programmable interconnection circuits are programmable to route signals between the programmable logic circuits and the non-programmable circuits through the first and second router circuits. The circuit system may include additional IC dies. The first and second IC dies and any additional IC dies are coupled in a vertically stacked configuration.

Three dimensional programmable logic circuit systems and methods

Growing community of inventors

Santa Cruz, CA, United States of America

Sean R Atsatt