Koh Young Technology Inc.

Se Rin Lee

Jin Man Kang

Joong Ki Jeong

Min Cheol Yoon

Jung Ho Son

A printed circuit board inspection apparatus can inspect the mounting state of a component by generating depth information on the component mounted on a printed circuit board by using a pattern of light reflected from the component and received by an image sensor, inputting the generated depth information into a machine-learning-based model, obtaining depth information with reduced noise from the machine-learning-based model, and using depth information with reduced noise.

Method for inspecting mounting state of component, printed circuit board inspection apparatus, and computer readable recording medium

A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining depth information with reduced noise from the machine learning-based model, and using the noise-reduced information.

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San Diego, CA, United States of America

Se Rin Lee