Intel Corporation

Scott Siers

Satish K Damaraju

Christopher M Pelto

Compute complexes, base dies, and methods related to leveraging reticle stitching for improved device interconnects are discussed. A base die includes first and second regions having device layers, lower level metallization layers, and through vias fabricated using the same reticles. In the first region, a first subset of the through vias are contacted by higher metallization layers and, in the second region, a second distinct subset of the through vias are contacted by higher metallization layers such that the first and second metallization layers provide unique routing through vias having shared layouts and relative locations in the first and second regions.

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Elk Grove, CA, United States of America

Scott Siers