Applied Materials, Inc.

Scott Meyer

Douglas Richards

Evanson G Baiya

Jeffrey C Hudgens

Charles T Carlson

James S Papanu

Victor B Mimken

Mike Rice

Penchala N Kankanala

Wyland L Atkins

John J Rosato

Constantin Predoaica

Paul Lester

A method and apparatus for efficiently exhausting harmful vapors and fumes from a substrate processing chamber is described. The processing chamber includes a lower volume configured as a liquid atmosphere, and an upper volume configured as a gaseous atmosphere to at least partially contain vapors or fumes above the liquid. The apparatus includes a lid member configured to seal the processing chamber and a lid assembly adapted to provide processing liquids while exhausting the vapors or fumes from the processing chamber. Switchable valves and/or a variable source of negative pressure may be coupled to the lid assembly to provide a controlled exhaust. A method of preventing or minimizing the escape of fumes or vapors is also described.

Process chamber lid and controlled exhaust

The present invention generally provides an apparatus and method for processing and transferring substrates in a multi-chamber processing system that has the capability of receiving and performing single substrate processing steps performed in parallel, while using the many favorable aspects of batch processing. Embodiments of the invention described herein are adapted to maximize system throughput, reduce system cost, reduce cost per substrate during processing, increase system reliability, improve the device yield on the processed substrates, and reduce system footprint. In one embodiment, the cluster tool is adapted to perform a wet/clean process sequence in which various substrate cleaning processes are performed on a substrate in the cluster tool.

Wet clean system design

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Boise, ID, United States of America

Scott Meyer