Micron Technology Incorporated

Other

Nan Ya Technology Corporation

Scott James Derner

Charles L Ingalls

Christopher John Kawamura

Casey R Kurth

Phillip G Wald

Patrick J Mullarkey

Brent Keeth

Stephen R Porter

Michael Amiel Shore

Layne G Bunker

Scot M Graham

Tae Hyoung Kim

Fatma Arzum Simsek-Ege

Ethan Williford

Steve V Cole

Daniele Vimercati

Yuan He

Umberto Di Vincenzo

Howard Kirsch

Eric S Carman

Jiyun Li

Gurtej S Sandhu

Hiroki Fujisawa

Kevin G Duesman

Jeffrey P Wright

Debra M Bell

Huy Thanh Vo

Richard J Hill

Venkatraghavan Bringivijayaraghavan

Suraj J Mathew

Daryl L Habersetzer

Abhay S Dixit

Vinay Nair

Diem Thy N Tran

Raghunath Singanamalla

Toby D Robbs

Gloria Yang

Zhong-Yi Xia

Christopher J Kawamura

Christopher Johnson Kawamura

Some embodiments include an integrated assembly having first conductive lines which extend along a first direction, and having second conductive lines over the first conductive lines and which extend along a second direction that crosses the first direction. Capacitors are over the second conductive lines. The second conductive lines are operatively proximate active structures to gatedly couple a first set of the capacitors to the first conductive lines through the active structures. Shield structures are between the first conductive lines and extend along the first direction. A voltage source is electrically coupled to the shield structures through a second set of the capacitors. Some embodiments include assemblies having two or more decks stacked one atop another.

Integrated assemblies having voltage sources coupled to shields and/or plate electrodes through capacitors

An apparatus, such as a memory array, can have a memory cell coupled to a first digit line (e.g., a local digit line) at a first level. A second digit line (e.g., hierarchical digit line) at a second level can be coupled to a main sense amplifier. A charge sharing device at a third level between the first and second levels can be coupled to the first digit line and to a connector. A vertical transistor at the third level can be coupled between the first digit line and the connector. A contact can be coupled between the connector and the second digit line.

Memory arrays with vertical transistors and the formation thereof

Methods, systems, and devices for sensing a memory with shared sense components are described. A device may activate a word line and a plate line each coupled with a set of memory cells, where each memory cell of the set of memory cells is coupled with a respective digit line of a set of digit lines. The device may activate a set of switching components to couple each digit line of the set of digit lines with a respective sense component of a set of sense components, where each switching component of the set of switching components is coupled with a respective memory cell of the set of memory cells. The device may sense the set of memory cells based on activating the word line and the plate line and based on coupling the set of digit lines with the set of sense components.

Sensing scheme for a memory with shared sense components

Computer-readable media and methods for a geospatial image map are disclosed. A computer-readable medium has computer-readable instructions stored thereon. The computer-readable instructions are configured to instruct one or more processors to display a map of a selected geographic region on an electronic display. The map includes geographic sub-regions displayed within the map. The computer-readable instructions are configured to instruct the one or more processors to select discrete images corresponding to the geographic sub-regions, and display the discrete images at the same time on the electronic display as an overlay to the map. A method includes displaying a map of a selected geographic region, displaying geographic sub-regions of the selected geographic region, selecting discrete images corresponding to the geographic sub-regions and one or more selected categories, and displaying the discrete images simultaneously on the electronic display as an overlay to the map.

Computer-readable media and methods for generating a geospatial image map

Methods, systems, and apparatuses for storing operational information related to operation of a non-volatile array are described. For example, the operational information may be stored in a in a subarray of a memory array for use in analyzing errors in the operation of memory array. In some examples, an array driver may be located between a command decoder and a memory array. The array driver may receive a signal pattern used to execute an access instruction for accessing non-volatile memory cells of a memory array and may access the first set of non-volatile memory cells according to the signal pattern. The array driver may also store the access instruction (e.g., the binary representation of the access instruction) at a non-volatile subarray of the memory array.

Storing memory array operational information in non-volatile subarrays

Some embodiments include an integrated assembly having a primary access transistor. The primary access transistor has a first source/drain region and a second source/drain region. The first and second source/drain regions are coupled to one another when the primary access transistor is in an ON mode, and are not coupled to one another when the primary access transistor is in an OFF mode. A charge-storage device is coupled with the first source/drain region. A digit line is coupled with the second source/drain region through a secondary access device. The secondary access device has an ON mode and an OFF mode. The digit line is coupled with the charge-storage device only when both the primary access transistor and the secondary access device are in their respective ON modes.

Integrated memory comprising secondary access devices between digit lines and primary access devices

Some embodiments include an integrated assembly. The integrated assembly has a first transistor with a horizontally-extending channel region between a first source/drain region and a second source/drain region; has a second transistor with a vertically-extending channel region between a third source/drain region and a fourth source/drain region; and has a capacitor between the first and second transistors. The capacitor has a first electrode, a second electrode, and an insulative material between the first and second electrodes. The first electrode is electrically connected with the first source/drain region, and the second electrode is electrically connected with the third source/drain region. A digit line is electrically connected with the second source/drain region. A conductive structure is electrically connected with the fourth source/drain region.

Integrated components which have both horizontally-oriented transistors and vertically-oriented transistors

Apparatuses and methods for memory including ferroelectric memory cells and dielectric memory cells are disclosed. The apparatus includes a first memory cell including first and second ferroelectric capacitors configured to store charges representing complementary logical values, a second memory cell including first and second dielectric capacitors configured to store charges representing complementary logical values, a first bit line selectably coupled to the first ferroelectric capacitor of the first memory cell and to the first dielectric capacitor of the second memory cell, a second bit line selectably coupled to the second ferroelectric capacitor of the first memory cell and to the second dielectric capacitor of the second memory cell, and a sense amplifier coupled to the first and second bit lines.

Apparatuses and methods for memory including ferroelectric memory cells and dielectric memory cells

An example apparatus includes a sense amplifier, a plurality of storage memory cells coupled to the sense amplifier via a first digit line, and a plurality of offset memory cells coupled to the sense amplifier via a second digit line. The plurality of storage memory cells and the plurality of offset memory cells can comprise an array of memory cells. Each of the storage memory cells and the offset memory cells can include a respective capacitor having a particular capacitance.

Storage and offset memory cells

Methods, systems, and apparatuses for memory array bit inversion are described. A memory cell (e.g., a ferroelectric memory cell) may be written with a charge associated with a logic state that may be the inverse of the intended logic state of the cell. That is, the actual logic state of one or more memory cells may be inverted, but the intended logic state of the memory cells may remain unchanged. Different sets of transistors may be configured around a sense component of a cell to enable reading and writing of intended and inverted logic states from or to the cell. For instance, a first set of transistors may be used to read the logic state currently stored at a memory cell, while a second set of transistors may be used to read a logic state inverted from the currently stored logic state.

Array data bit inversion

Apparatuses and methods are disclosed that include ferroelectric memory and for operating ferroelectric memory. An example apparatus includes a capacitor having a first plate, a second plate, and a ferroelectric dielectric material. The apparatus further includes a first digit line and a first selection component configured to couple the first plate to the first digit line, and also includes a second digit line and a second selection component configured to couple the second plate to the second digit line.

Apparatuses and methods including ferroelectric memory and for operating ferroelectric memory

Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A memory device may maintain a digit line voltage at a ground reference for a duration associated with biasing a ferroelectric capacitor of a memory cell. For example, a digit line that is in electronic communication with a ferroelectric capacitor may be virtually grounded while a voltage is applied to a plate of the ferroelectric capacitor, and the ferroelectric capacitor may be isolated from the virtual ground after a threshold associated with applying the voltage to the plate is reached. A switching component (e.g., a transistor) that is in electronic communication with the digit line and virtual ground may be activated to virtually ground the digit line and deactivated to isolate the digit line from virtual ground.

Ferroelectric memory cell sensing

Some embodiments include an integrated assembly having an access transistor. The access transistor has a first source/drain region gatedly coupled with a second source/drain region. A digit line is coupled with the first source/drain region. A charge-storage device is coupled with the second source/drain region through an interconnect. The interconnect includes a length of a semiconductor material. A protective transistor gates a portion of the length of the semiconductor material.

Integrated memory comprising gated regions between charge-storage devices and access devices

Growing community of inventors

Boise, ID, United States of America

Scott James Derner