Fujifilm Electronic Materials U.s.a., Inc.

Saul Alvarado

James McDonough

Chemical mechanical polishing compositions include an abrasive, an additive, and water. The polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 μm bin size.

Polishing compositions for reduced defectivity and methods of using the same

Chemical mechanical polishing compositions include an abrasive, an additive, and water. The polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 &#x3bc;m bin size.

Chemical mechanical polishing compositions include an abrasive, a first removal rate enhancer; and water; wherein the polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 &#x3bc;m bin size.

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Tempe, AZ, United States of America

Saul Alvarado