Resonac Corporation

Satoyuki Nomura

Tomohiro Iwano

Tomoyasu Hasegawa

Takaaki Matsumoto

Tomomi Kukita

A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the second particles contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and a ratio of the lowest valence among the plurality of valences of the metal is 0.10 or more in X-ray photoelectron spectroscopy.

Slurry and polishing method

A slurry containing abrasive grains and a liquid medium, in which the abrasive grains contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and when the slurry is brought into contact with a surface to be polished to bring the abrasive grains into contact with the surface to be polished, the slurry yields 0.13 or more in X-ray photoelectron spectroscopy as a ratio of the lowest valence among the plurality of valences of the metal.

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Tokyo, Japan

Satoyuki Nomura