Tokyo Electron Limited

Satoshi Gomi

Koichi Miyashita

Katsuhito Hirose

Yasunori Kumagai

Gaku Ikeda

Kunio Takano

Minoru Nagasawa

Takamasa Chikuma

Chunmui Li

Takashi Chino

Takashi Yoshiyama

Yoshie Eda

Hiroshi Hirose

Makoto Horikawa

According to one embodiment of the present disclosure, there is provided a substrate processing system for processing a plurality of substrates including: a processor configured to perform a process on the substrate; a transport device configured to repeatedly transport the plurality of substrates with respect to the processor; and a controller configured to control the process of the substrate in the processor, wherein the controller is configured to: execute the process based on a process recipe, which is a control program for executing the process; and set an offset time, which is a function corresponding to a number of the substrates processed by the processor or a function corresponding to a parameter equivalent to the number of the processed substrates, with respect to a step time for a step of the process recipe.

Substrate processing system, substrate processing method, and controller

A processing apparatus for processing a substrate includes: a plurality of end devices; a low-level controller configured to control specific end devices among the plurality of end devices; and a module controller configured to execute a recipe for processing the substrate, to specify control steps satisfying a specific condition among a plurality of control steps of the recipe, and to transmit the specified control steps to the low-level controller, wherein the low-level controller controls the specific end devices based on the control steps received from the module controller.

Processing apparatus and processing method

A semiconductor manufacturing system includes circuitry configured to execute: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is 'automatic' or 'manual' execution; receiving an inspection start command and reading the first inspection item from a storage unit. The circuitry also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and &#x201c;automatic&#x201d;; (b) the read-out inspection item being the manipulation item and &#x201c;manual&#x201d;; (c) the read-out inspection item being the check item and &#x201c;automatic&#x201d;; and (d) the read-out inspection item being the check item and &#x201c;manual&#x201d;.

Semiconductor manufacturing system

A method of detecting an abnormal placement of a substrate W, which is carried out when a substrate W placed on a substrate table, in which a heateris disposed, is processed by heating. The method of detecting an abnormal placement of the substrate comprises the steps of: during processing of the substrate W, based on information about an electric output to the heateror information about a measured temperature of the substrate table, detecting of a maximum value and a minimum value of the electric output or the measured temperature, or an integrated value of the electric output or the measured temperature; and judging of the abnormal placement of the substrate based on the maximum value and the minimum value detected, or the integrated value detected.

Method of detecting abnormal placement of substrate, substrate processing method, computer-readable storage medium, and substrate processing apparatus

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Nirasaki, Japan

Satoshi Gomi