Tokyo Electron Limited

Eisai Company, Limited

Scivax Corporation.

Ricoh Company, Ltd.

Mitsubishi Electric Corporation

Nikkiso Company Limited

Shin-etsu Chemical Co., Ltd.

Mitsubishi Heavy Industries Limited

Yokogawa Electric Corporation

Nippon Steel & Sumitomo Metal Corporation

Horiba, Ltd.

Vodafone Group Plc.

Mitsubishi Heavy Industries Thermal Systems, Ltd.

Tokyo Electric Power Company Holdings, Inc.

Jsr Corporation

Satoru Tanaka

Takehiko Orii

Kenji Sekiguchi

Hideaki Watanabe

Hiroki Ohno

Koichiro Ueda

Meitoku Aibara

Itaru Kanno

Teruomi Minami

Kazuyoshi Shinohara

Yutaka Taniguchi

Yuki Yoshida

Tadashi Sato

Tetsuhiko Inazu

Noritaka Niwa

Tsuneo Wakabayashi

Yosuke Kawabuchi

Keiji Tanouchi

Miyako Kaneko

Mitsunori Nakamori

Hisashi Kawano

Toshiaki Kato

Mitsunori Kori

Yumi Tanaka

Hideki Ono

Takeshi Yamamoto

Akio Saito

Takahisa Kusuura

Norio Minami

Nobuhiro Ogata

Norihiro Ito

Takuya Mori

Kazuhiro Takeshita

Gentaro Goshi

Seiki Nishida

Takeshi Yasui

Kazuhiro Aiura

Koki Tateishi

Yusuke Saito

Yoshihiro Kai

Toshiji Igarashi

Akira Takahashi

Hirosuke Kawaguchi

Kazunori Hashimoto

Akifumi Nawata

Katsutoshi Shimada

Kiichi Ema

Noritaka Uchida

Keiichi Munakata

Issei Ohtsuka

Hiroyuki Suzuki

Toshinobu Kunii

Toshiharu Ohgoh

Kouichiro Ueda

Kengo Kagei

Mayumi Kawase

Yasumasa Suzaki

Hirotaka Maruyama

Takeo Takakura

Kotaro Oishi

Naoyuki Kita

Nobuyuki Kawabata

Tatsuya Hagino

Satoshi Nikaido

Hiromi Kiyose

Hiroomi Motohashi

Takashi Yabuta

Yoshinori Ikeda

Satoshi Biwa

Go Takami

Tetsuya Oda

Takuro Masuzumi

Shinichiro Shimomura

Tsukasa Hirayama

Akira Ishihara

Nobuhiko Mouri

Shogo Mizota

Masaru Amai

Yusuke Hazui

Yoshiaki Takaya

Tooru Oohashi

Yoshihisa Hayashida

Yuji Hashima

Tatsuya Nagamatsu

Kyoichi Kobashi

Yutaka Takenaka

Fujiko Ozawa

Yukimasa Saito

Toru Ihara

Tamotsu Kanazawa

Kenji Nishi

Kentaro Okada

Yuji Murakami

Masaru Satoh

Naohiko Hamamura

Katsufumi Matsuki

Hidetoshi Nakao

Nayuta Kawazu

Hirotaka Hanasaki

Nobuyoshi Awaya

A substrate processing method of drying a substrate by using a processing fluid in a supercritical state is performed by a substrate processing apparatus. The substrate processing apparatus includes a fluid discharge unit, a supply line, a fluid drain unit, a drain line and a flow control device. The substrate processing method includes: flowing the processing fluid from the fluid discharge unit to the fluid drain unit such that the processing fluid flows along a surface of the substrate. The flowing of the processing fluid includes flowing the processing fluid in a first flow mode and flowing the processing fluid in a second flow mode. Between the first flow mode and the second flow mode, a flow direction distribution of the processing fluid is different, and a switchover between the first flow mode and the second flow mode is performed by the flow control device.

Substrate processing method and substrate processing apparatus

The present disclosure provides an imprinting device and an imprinting method. The present disclosure also provides a stamp comprising a resin-made molding component.

Imprint device and imprint method

A lens and an optical system device are provided which can measure optical characteristics of a light source or an optical element with a simple structure. A lenshas an optical axis, and includes an incident surface F and an emit surface B. The incident surface F and the emit surface B are formed so as to emit incident light to the incident surface F from a first position O at an irradiation angle θ relative to the optical axis from the emit surface B at an emit angle θ/m (where m>1) relative to the optical axis by refraction at the incident surface F and at the emit surface B, and formed in such a way that apparent positions of lights emitted from the emit surface B all begin from a second position P. Moreover, an optical system device includes the lensand a diffuser panel that diffuses emitted light from the lens

Lens and optical system device

An attached body production method having a sealing material disposing step for disposing a sealing material on a mold and/or a molded product so that a molded surface of the molded product is surrounded by the sealing material when the mold and the molded product are attached together; a pressure reduction step for reducing the pressure of the atmosphere around the mold and the molded product in a state where the mold and the molded product are separated from each other; a sealing step for putting the mold and the molded product on top of each other, and sealing a space between the moldand the molded product with the sealing material; and a first pressure-application step for applying pressure with a fluid in a state where the space between the mold and the molded product is sealed, wherein the sealing material has fluidity in at least the sealing step, and is configured to attach to only one of the mold and the molded product when the molded product is released from the mold.

Attached body production method, attached body, and microstructure formation method

Provided is a control apparatus including an acquisition unit configured to acquire a measurement value measured regarding control target equipment, a first control unit configured to output an operation amount of the control target equipment according to the measurement value by at least one of feedback control or feed-forward control, a second control unit configured to output an operation amount of the control target equipment according to the measurement value using a model learnt by using learning data, and a switching unit configured to perform switching between the first control unit and the second control unit by which the control target equipment is controlled.

Control apparatus, control method, and storage medium

A semiconductor light emitting device includes a light extraction layer having a light extraction surface. The light extraction layer includes: a plurality of cone-shaped parts formed in an array on the light extraction surface, and a plurality of granular parts formed both on a side part of the cone-shaped part and in a space between adjacent cone-shaped parts. A method of manufacturing the semiconductor light emitting device includes: forming a mask having an array pattern on the light extraction layer; and etching the mask and the light extraction layer from above the mask. The etching includes first dry-etching performed until an entirety of the mask is removed and second dry-etching performed to further dry-etch the light extraction layer after the mask is removed.

Semiconductor light emitting device and method of manufacturing semiconductor light emitting device having pattered light extraction surface

A semiconductor light emitting device includes a light extraction layer having a light extraction surface. Multiple cone-shaped parts formed in an array are provided on the light extraction surface of the semiconductor light emitting device. A proportion of an area occupied by the multiple cone-shaped parts per a unit area of the light extraction surface is not less than 65% and not more than 95% in a plan view of the light extraction surface, and an aspect ratio h/p defined as a proportion of a height h of the cone-shaped part relative to a distance p between apexes of adjacent cone-shaped parts is not less than 0.3 and not more than 1.0.

Semiconductor light emitting device and method of manufacturing semiconductor light emitting device

A method for cleaning a substrate includes supplying to a substrate on which a resist layer is not formed a film-forming processing liquid which includes a volatile component and forms a film on the substrate, forming a processing film on the substrate by solidifying or curing the film-forming processing liquid supplied on the substrate, and supplying to the substrate having the processing film a strip-processing liquid which strips the processing film from the substrate.

Substrate cleaning method, substrate cleaning system, and memory medium

A superordinate controlling device for a heat source system () including a plurality of heat sources, the superordinate controlling device being applied to the heat source system () and controlling heat-pump type chillers () and () and absorption-type chillers () and () in such a manner that a heat transfer medium leaving temperature that is the temperature of a heat transfer medium supplied to an external load () is equal to a setting temperature. The heat-pump type chillers () and () each have a higher Coefficient of Performance (COP) than that of each of the absorption-type chillers () and (). The superordinate controlling device includes a heat transfer medium leaving temperature changing means for carrying out heat transfer medium leaving temperature control, by changing the heat transfer medium leaving temperatures of the heat-pump type chillers () and (), when a post-change prediction value of each of the absorption-type chiller () and () predicted based on a supposition that the heat transfer medium leaving temperatures of the heat-pump type chillers () and () are changed exceeds a second underload stop threshold value at which the corresponding one of the absorption-type chiller () and () would have an underload stop.

Heat source system controlling device, heat source system, heat source system controlling method, and heat source system controlling program

In an image provision apparatus (), a decomposition unit () decomposes image data into pieces of unit image data (). A storing unit () stores, in a memory unit (), image management information () including each piece of unit image data () of the pieces of unit image data and position information. An acquisition unit () accepts a provision request (). The provision request () includes range information representing a range of a partial image in the image. The acquisition unit () acquires a unit image data set () representing unit images each including at least part of the partial image from the image management information (), based on the range information and the position information. A generation unit () generates the partial image () based on the unit image data set ().

Image provision apparatus, image provision method, and computer readable medium

A semiconductor light emitting device includes a light extraction layer having a light extraction surface. Multiple cone-shaped parts formed in an array are provided on the light extraction surface. The cone-shaped part has a first portion having a first angle of inclination of a side surface and a second portion having a second angle of inclination of a side surface smaller than the first angle. The second portion is closer to an apex of the cone-shaped part than the first portion and has a larger height than the first portion.

A substrate processing method capable of suppressing particles from remaining on a surface of a substrate is provided. In the substrate processing method, a liquid film of a protection liquid is formed on the surface of the substrate, and the substrate is dried by using a supercritical fluid so that the protection liquid is removed from the surface of the substrate. After the substrate is dried, the particles remaining on the surface of the substrate is removed.

Substrate processing method, recording medium and substrate processing apparatus

An optical device including at least a part of a rotation body acquired by rotating a reference plane shape or a parallelly shifted body acquired by parallelly shifting the reference plane shape, the reference plane shape including an incidence portion allowing light from a predetermined site to enter, an emit portion that reflects the light which has traveled through the incidence portion and which is directly irradiated and a first reflection portion that reflects the reflected light by the emit portion toward the emit portion. The reference plane shape may include a second reflection portion that reflects the light which has traveled through the incidence portion and which is directly irradiated to the emit portion. An optical system apparatus includes a light source placed at the predetermined site.

Optical device and optical system apparatus

A method for cleaning a substrate includes supplying to a substrate a film-forming processing liquid which includes a volatile component and forms a film on the substrate, vaporizing the volatile component in the film-forming processing liquid such that the film-forming processing liquid solidifies or cures on the substrate and forms a processing film on the substrate, supplying to the substrate having the processing film a strip-processing liquid which strips the processing film from the substrate, and supplying to the processing film formed on the substrate a dissolving-processing liquid which dissolves the processing film after the supplying of the strip-processing liquid.

A roller-type depressing device, an imprinting device, and a roller-type depressing method which are capable of suppressing an uneven elastic deformation of a main roller, and which are also capable of depressing an object uniformly. A roller-type depressing device depresses an object, and includes a main roller having at least a surface formed of an elastic material, and depressing the object, a roller moving unit moving the main roller relative to the object, a pressure adjusting unit adjusting pressure applied to the object by the main roller, a pressure receiving stage receiving the pressure from the main roller via the object, an intermediate roller having at least a surface formed of a material with a larger elastic modulus than the elastic material, and supporting the main roller, and, a backup roller formed shorter in an axial direction than the main roller and the intermediate roller, and supporting the intermediate roller.

Roller-type depressing device, imprinting device, and roller-type depressing method

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Tokyo, Japan

Satoru Tanaka