Tokyo Electron Limited

Satoru Koike

Tsuneyuki Okabe

Hiromi Nitadori

Shinobu Kawamorita

Satoshi Kikuchi

A substrate processing apparatus includes: a substrate holder to vertically load a plurality of substrates in multiple stages with an interval therebetween and including a plurality of partition plates vertically partitioning a region where the plurality of substrates are loaded; a process chamber to receive the substrate holder therein; protrusions protruding inward toward the outer circumferential surfaces of the partition plates from an inner circumferential wall surface within the process chamber, which faces the outer circumferential surfaces of the partition plates, to form clearances between inner circumferential surfaces formed on the protruding tip ends of the protrusions and the outer circumferential surfaces of the partition plates; and a gas supply part to supply inert gas into the clearances, which are formed between the inner circumferential surfaces of the protrusions and the outer circumferential surfaces of the partition plates, to form positive-pressure sections subjected to a pressure higher than ambient pressure.

Substrate processing apparatus

A mixed gas multiple line supply system includes a flow splitter connected to a common mixed gas supplying passage, the flow splitter configured to split a mixed gas into a plurality of supply lines while adjusting a ratio of flow rates in the plurality of supply lines, and an least one injector including a gas introducing port and a gas discharge hole for each of a plurality of regions in the processing container and configured to supply the mixed gas to each of the plurality of regions. The plurality of supply lines of the flow splitter are connected in one-to-one correspondence to the respective gas introducing ports provided for the plurality of regions in the processing container.

Mixed gas multiple line supply system and substrate processing apparatus using same

There is provided a pressure measuring device including: a first pressure gauge connected to a processing chamber configured to process a process target and configured to measure an internal pressure of the processing chamber when the process target is being processed; a second pressure gauge connected to the processing chamber; and a first switching valve configured to disconnect the second pressure gauge from the processing chamber when the process target is being processed inside the processing chamber.

Pressure measuring device and exhaust system using the same, and substrate processing apparatus

There is provided a pressure measuring instrument including: a detecting unit including the reference pressure chamber therein and formed in a cylindrical shape, the diaphragm being disposed inside the detecting unit; a communicating unit for providing communication between the diaphragm and the measurement pressure chamber, and formed in a circular tube shape having an inner diameter smaller than an inner diameter of the detecting unit; and an annular flow-path forming unit disposed between the detecting unit and the communicating unit, and configured to form a substantially annular path. The communicating unit introduces a gas of the measurement pressure chamber into the substantially annular path. The annular flow-path forming unit allows the gas introduced from the communicating unit to pass through the substantially annular path and to supply the passing gas to a side surface of the diaphragm.

Growing community of inventors

Oshu, Japan

Satoru Koike