Applied Materials, Inc.

Other

Indigo Orb, Inc.

Satish Sundar

Mario David Silvetti

Swaminathan Balakrishnan

Christopher F Lane

Sekar Krishnasamy

Rinat Shimshi

Donald J Foldenauer

Vijay Sakhare

Mordechai Leska

Kevin P Fairbairn

Robert B Moore

Peter F Ebbing

Marvin L Freeman

Albert L Hartman

Ivan Melnyk

Kelly A Colborne

Jeffery Hudgens

Eric Ruhland

Ned G Matthews

Jeffrey C Hudgens

Sanjeev Baluja

Visweswaren Sivaramakrishnan

Hari K Ponnekanti

Randy Harris

Vinay K Shah

Dean C Hruzek

Jeffrey Allen Brodine

Mario Dave Silvetti

Surinder S Bedi

Jason A Rye

Pyongwon Yim

William P Laceky

William Nixon Taylor, Jr

Vincent Steffan Francischetti

Indrajit Lahiri

Bryan Puch

Venkatesh Babu

Douglas Kitajima

Prudhvi R Chintalapati

Allen Altwood

A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

Wafer processing system with chuck assembly maintenance module

Described herein is a method and apparatus for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes moving the calibrating device across a target (e.g., a wafer chuck). Next, the method includes measuring distances between light spots from the sensors and a perimeter of the target using the sensors located on the calibrating device. Next, the method includes determining a displacement of the calibrating device relative to a center of the target. Then, the method includes determining a rotation angle of the calibrating device relative to a system of coordinates of the target. Next, the method includes calibrating a robot position of the robot based on the displacement and rotation angle of the calibrating device with respect to the target.

Method and apparatus for robot calibrations with a calibrating device

Systems, apparatus and methods for transporting substrates between system components of an electronic device manufacturing system are provided. The systems and apparatus include an electrostatic end effector having a base, an electrode pair on the base, and spacer members for spacing the substrate from the electrode pairs to provide a gap between the electrode pair and the substrate. Methods of the invention as well as numerous other aspects are provided.

Electrostatic end effector apparatus, systems and methods

Described herein is a method and system for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes manually calibrating a center of a robot blade aligned with respect to a target. The method further includes recording a first positional value of the center of the robot blade aligned with respect to a camera. The method further includes automatically determining a second positional value of the center of the robot blade aligned with respect to the camera. The method further includes automatically recalibrating the robot blade based on an offset between the second positional value and the first positional value exceeding a tolerance offset from the first positional value.

Method and system for robot calibrations with a camera

A detection apparatus for, and a method of, detecting the location of the tip of a tubular element, in particular a needle, within a region, in particular one of the epidural space and the peritoneal cavity.

Detection apparatus and method

A controller for closed loop control of infusion devices is described. A variety of infusion systems are described that use the closed loop control architecture. In some embodiments the closed loop control may be adapted to current commonly used infusion means such as a gravity feed intravenous system. Other embodiments describe infusion pump system that use biasing or drive mechanisms of springs, elastomers, rotary and linear motors.

High precision infusion pump controller

A system architecture for closed loop control of infusion devices is described. The architecture provides means to control the flow from an infusion device as well as in some embodiments the pressure of the delivery. A variety of infusion systems are described that use the closed loop control architecture. In some embodiments the closed loop control may be adapted to current commonly used infusion means such as a gravity feed intravenous system. Other embodiments describe infusion pump system that use biasing or drive mechanisms of springs, elastomers, rotary and linear motors.

High precision infusion pumps

A new apparatus for processing substrates is disclosed. A multi-level load lock chamber having four environmentally isolated chambers interfaces with a transfer chamber that has a robotic assembly. The robotic assembly has two arms that each can move horizontally as the robotic assembly rotates about its axis. The arms can reach into the isolated chambers of the load lock to receive substrates from the bottom isolated chambers, transport the substrates to process chambers, and then place the substrates in the upper chambers. The isolated chambers in the load lock chamber may have a pivotably attached lid that may be opened to access the inside of the isolated chambers.

Apparatus and method for a multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same

A method and apparatus for positioning a substrate in a substrate processing chamber. The method includes placing the substrate on a substrate transfer blade, moving the substrate transfer blade to a first position located in a transfer chamber, and capturing at least one image that includes at least a portion of the substrate transfer blade and at least a portion of the substrate. The method also includes processing the image to determine a position of a predetermined portion of the substrate transfer blade and a position of predetermined portion of the substrate. The method further includes determining an offset between the position of the predetermined portion of the substrate transfer blade and the position of the predetermined portion of the substrate, and moving the substrate transfer blade to a second position located in the substrate processing chamber, wherein the second position is adjusted to account for the offset.

Method for on the fly positioning and continuous monitoring of a substrate in a chamber

Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same

In one embodiment, a substrate centering apparatus for centering a substrate on a substrate support is provided. In one embodiment, the invention comprises an apparatus that is mounted to an underside of a substrate support and includes a lever that projects upward through a support surface of the substrate support. The lever may be biased toward a center of the substrate support to contact an edge of a substrate. A mechanism is coupled to the lever and moves the lever radially outward to release the substrate. In one embodiment, the mechanism is actuated as the substrate support moves downward to a position that facilitates substrate handoff.

Substrate gripping apparatus

In one embodiment, the invention is a substrate edge gripper assembly for positioning a semiconductor substrate upon a transfer robot. In one embodiment, a modular assembly comprises spring loaded jaws that are mounted on either side of a robot end effector. The jaws are adapted to be actuated by a feature remote from the robot end effector to release the substrate for delivery.

Substrate edge grip apparatus

A robotic positioning system that cooperates with a sensing system to correct robot motion is provided. The sensing system is decoupled from the sensors used conventionally to control the robot's motion, thereby providing repeatable detection of the robot's true position. In one embodiment, the positioning system includes a robot, a controller, a motor sensor and a decoupled sensor. The robot has at least one motor for manipulating a linkage controlling the displacement of a substrate support coupled thereto. The motor sensor is provides the controller with motor actuation information utilized to move the substrate support. The decoupled sensor provides information indicative of the true position the substrate support that may be utilized to correct the robot's motion.

Method and apparatus for monitoring the position of a semiconductor processing robot

Growing community of inventors

Milpitas, CA, United States of America

Satish Sundar