Cree Gmbh

Wolfspeed, Inc.

Macom Technology Solutions Holdings, Inc.

Saptharishi Sriram

Scott Thomas Sheppard

Fabian Radulescu

Yueying Liu

Alexander V Suvorov

Helmut Hagleitner

Jennifer Qingzhu Gao

Jason Patrick Henning

Jeremy Fisher

Christer Hallin

Thomas J Smith, Jr

Scott Thomas Allen

Jia Guo

Terry Alcorn

Thomas C Smith

Richard Peter Smith

Zoltan Ring

Allan Ward

Andrew K Mackenzie

Matt Willis

Qingchun Zhang

Kyle Bothe

Dan Namishia

Charles W Richards, Iv

Keith Dennis Wieber

Matt King

Matthew Wills

Daniel Etter

Thomas J Smith

Jr Thomas J Smith

Andrew Mackenzie

Allan Iii Ward

Matthew Willis

Qinchung Zhang

An apparatus to address gate lag effect and/or other negative performance includes a substrate; a group III-Nitride buffer layer on the substrate; a group III-Nitride barrier layer on the group III-Nitride buffer layer, the group III-Nitride barrier layer may include a higher bandgap than a bandgap of the group III-Nitride buffer layer; a source electrically coupled to the group III-Nitride barrier layer; a gate electrically coupled to the group III-Nitride barrier layer; a drain electrically coupled to the group III-Nitride barrier layer; and a p-region being arranged at least in the substrate. In particular, the p-region extends toward a source side of the substrate; and the p-region extends toward a drain side of the substrate.

Group III-nitride high-electron mobility transistors with gate connected buried p-type layers and process for making the same

An apparatus includes a substrate. The apparatus further includes a group III-nitride buffer layer on the substrate; a group III-nitride barrier layer on the group III-nitride buffer layer, the group III-nitride barrier layer including a higher bandgap than a bandgap of the group III-nitride buffer layer. The apparatus further includes a source electrically coupled to the group III-nitride barrier layer; a gate electrically coupled to the group III-nitride barrier layer; a drain electrically coupled to the group III-nitride barrier layer; and a p-region being at least one of the following: in the substrate or on the substrate below said group III-nitride barrier layer.

Group III-nitride high-electron mobility transistors with buried p-type layers and process for making the same

An apparatus for reducing lag includes a substrate; a group III-Nitride barrier layer; a source electrically coupled to the group III-Nitride barrier layer; a gate on the group III-Nitride barrier layer; a drain electrically coupled to the group III-Nitride barrier layer; a p-region being arranged at or below the group III-Nitride barrier layer; and a gate control circuit configured to control a gate voltage of the gate. Additionally, at least a portion of the p-region is arranged vertically below at least one of the following: the source, the gate, and an area between the gate and the drain.

Circuits and group III-nitride transistors with buried p-layers and controlled gate voltages and methods thereof

A transistor device according to some embodiments includes a channel layer, a barrier layer on the channel layer, and source and drain contacts on the barrier layer, and a gate contact on the barrier layer between the source and drain contacts. The channel layer includes a sub-layer having an increased doping concentration level relative to a remaining portion of the channel layer. The presence of the sub-layer may reduce drain lag without substantially increasing gate lag.

Field effect transistor with selective channel layer doping

An apparatus includes a substrate; a group III-Nitride buffer layer on the substrate; a group III-Nitride barrier layer on the group III-Nitride buffer layer, the group III-Nitride barrier layer may include a higher bandgap than a bandgap of the group III-Nitride buffer layer; a source electrically coupled to the group III-Nitride barrier layer; a gate electrically coupled to the group III-Nitride barrier layer; a drain electrically coupled to the group III-Nitride barrier layer; and a conductive metallic region being at least one of the following: in the substrate or on the substrate below said group III-Nitride barrier layer. Additionally, the conductive metallic region is structured and arranged to extend a limited length parallel to said group III-Nitride barrier layer.

Group III-nitride high-electron mobility transistors with a buried metallic conductive material layer and process for making the same

A high-electron mobility transistor includes a substrate layer, a first buffer layer provided on the substrate layer, a barrier layer provided on the first buffer layer, a source provided on the barrier layer, a drain provided on the barrier layer, and a gate provided on the barrier layer. The transistor further includes a p-type material layer having a length parallel to a surface of the substrate layer over which the first buffer layer is provided, the length of the p-type material layer being less than an entire length of the substrate layer. The p-type material layer is provided in one of the following: the substrate layer, or the first buffer layer. A process of making the high-electron mobility transistor is disclosed as well.

Gallium Nitride high-electron mobility transistors with p-type layers and process for making the same

A semiconductor device includes a plurality of unit cell transistors on a common semiconductor structure, the unit cell transistors electrically connected in parallel, and each unit cell transistor including a respective gate finger. Respective threshold voltages of first and second of the unit cell transistors differ by at least 0.1 volts and/or threshold voltages of first and second segments of a third of the unit cell transistors differ by at least 0.1 volts.

Semiconductor devices having unit cell transistors with smoothed turn-on behavior and improved linearity

An apparatus includes a substrate; a group III-Nitride barrier layer; a source electrically coupled to the group III-Nitride barrier layer; a gate on the group III-Nitride barrier layer; a drain electrically coupled to the group III-Nitride barrier layer; a p-region being arranged at or below the group III-Nitride barrier layer; and a recovery enhancement circuit configured to reduce an impact of an overload received by the gate. Additionally, at least a portion of the p-region is arranged vertically below at least one of the following: the source, the gate, an area between the gate and the drain.

Circuits and group III-nitride high-electron mobility transistors with buried p-type layers improving overload recovery and process for implementing the same

A transistor device includes a semiconductor epitaxial layer structure including a channel layer and a barrier layer on the channel layer, a source contact and a drain contact on the barrier layer, an insulating layer on the semiconductor layer between the source contact and the drain contact, and a gate contact on the insulating layer. The gate contact includes a central portion that extends through the insulating layer and contacts the barrier layer and a drain side wing that extends laterally from the central portion of the gate toward the drain contact by a distance &#x393;. The drain side wing of the gate contact is spaced apart from the barrier layer by a distance dthat is equal to a thickness of the insulating layer. The distance &#x393;is less than about 0.3 &#x3bc;m, and the distance dis less than about 80 nm.

Field effect transistor with enhanced reliability

A gallium nitride based monolithic microwave integrated circuit includes a substrate, a channel layer on the substrate and a barrier layer on the channel layer. A recess is provided in a top surface of the barrier layer. First gate, source and drain electrodes are provided on the barrier layer opposite the channel layer, with a bottom surface of the first gate electrode in direct contact with the barrier layer. Second gate, source and drain electrodes are also provided on the barrier layer opposite the channel layer. A gate insulating layer is provided in the recess in the barrier layer, and the second gate electrode is on the gate insulating layer opposite the barrier layer and extending into the recess. The first gate, source and drain electrodes comprise the electrodes of a depletion mode transistor, and the second gate, source and drain electrodes comprise the electrodes of an enhancement mode transistor.

Monolithic microwave integrated circuits having both enhancement-mode and depletion mode transistors

A device includes a substrate; a buffer layer on the substrate; a barrier layer on the buffer layer, a source electrically coupled to the barrier layer; a gate electrically coupled to the barrier layer; and a drain electrically coupled to the barrier layer. The device further includes an electron concentration reduction structure arranged with at least one of the following: in the barrier layer and on the barrier layer. The electron concentration reduction structure is configured to at least one of the following: reduce electron concentration around the gate, reduce electron concentration around an edge of the gate, reduce electron concentration, increase power gain, increase efficiency, decouple the gate from the drain, decouple the gate from the source, and reduce capacitance.

Structures for reducing electron concentration and process for reducing electron concentration

Gallium nitride high-electron mobility transistors with p-type layers and process for making the same

A transistor device is provided. The transistor device includes a substrate, a channel layer on the substrate, the channel layer including a GaN material, a barrier layer that is on the channel layer and that includes an AlGaN material, a drain electrode that is on the barrier layer in a drain region of the device, a source ohmic structure that is at least partially recessed into the barrier layer in a source region of the device, a source electrode that is on the source ohmic structure and a gate contact that is on the barrier layer and that is in a gate region of the device that is between the drain region and the source region.

Depletion mode semiconductor devices including current dependent resistance

Semiconductor devices having a plurality of unit cell transistors that have smoothed turn-on behavior and improved linearity

Growing community of inventors

Cary, NC, United States of America

Saptharishi Sriram