Samsung Electronics Co., Ltd.

Sang-Uhn Cha

Hoi-ju Chung

Ye-Sin Ryu

Hyun-Joong Kim

Ho-Young Song

In-Woo Jun

Seong-Jin Jang

Kwang-il Park

Young-Hun Seo

Hoon Sin

Young-Sik Kim

Jong-Pil Son

Su-Yeon Doo

Hyun-Gi Kim

Seung-Jun Bae

Seong-Jin Cho

Chul-woo Park

Uk-Song Kang

Kyung-Ryun Kim

Myeong-O Kim

Ju-yun Jung

Hoi-Ju Chung

Kyo-Min Sohn

Young-Yong Byun

Nam-Sung Kim

Yoon-Na Oh

Deok-Gu Yoon

A semiconductor memory device includes a memory cell array, an error correction circuit, an error log register and a control logic circuit. The memory cell array includes a plurality of memory bank arrays and each of the memory bank arrays includes a plurality of pages. The control logic circuit is configured to control the error correction circuit to perform an ECC decoding sequentially on some of the pages designated at least one access address for detecting at least one bit error, in response to a first command received from a memory controller. The control logic circuit performs an error logging operation to write page error information into the error log register and the page error information includes a number of error occurrence on each of the some pages determined from the detecting.

Semiconductor memory devices, memory systems including the same and methods of operating memory systems

A semiconductor memory device includes a memory cell array, an error correction code (ECC) engine, a refresh control circuit, a scrubbing control circuit and a control logic circuit. The refresh control circuit generates refresh row addresses for refreshing a memory region on memory cell rows in response to a first command received from a memory controller. The scrubbing control circuit counts the refresh row addresses and generates a scrubbing address for performing a scrubbing operation on a first memory cell row of the memory cell rows whenever the scrubbing control circuit counts N refresh row addresses of the refresh row addresses. The ECC engine reads first data corresponding to a first codeword, from at least one sub-page in the first memory cell row, corrects at least one error bit in the first codeword and writes back the corrected first codeword in a corresponding memory location.

Semiconductor memory devices, memory systems and methods of operating semiconductor memory devices

An error detection code generation circuit of a semiconductor device includes a first cyclic redundancy check (CRC) engine, a second CRC engine and an output selection engine. The first CRC engine generates first error detection code bits using a first generation matrix, based on a plurality of first unit data and first DBI bits in response to a mode signal. The second CRC engine generates second error detection code bits using a second generation matrix, based on a plurality second unit data and second DBI bits, in response to the mode signal. The output selection engine generates final error detection code bits by merging the first error detection code bits and the second error detection code bits in response to the mode signal. The first generation matrix is the same as the second generation matrix.

Error detection code generation circuits of semiconductor devices, memory controllers including the same and semiconductor memory devices including the same

A semiconductor memory device is provided. The device includes a memory cell array including a plurality of dynamic memory cells; an error correction code (ECC) engine; an input/output (I/O) gating circuit connected between the ECC engine and the memory cell array; an error information register configured to store an error address and a first syndrome, the error address and the first syndrome being associated with a first error bit in a first codeword stored in a first page of the memory cell array; and a control logic configured to, based on the first codeword being read again and including a second error bit which is different from the first error bit, recover a second syndrome associated with the second error bit by using the first syndrome stored in the error information register and sequentially correct the first error bit and the second error bit.

A method of operating a semiconductor memory device can include receiving data, from a memory controller, at an Error Correction Code (ECC) engine included in the semiconductor memory device, the data including at least one predetermined error. Predetermined parity can be received at the ECC engine, where the predetermined parity is configured to correspond to the data without the at least one predetermined error. A determination can be made whether a number of errors in the data is correctable by the ECC engine using the data including the at least one predetermined error and the predetermined parity.

Characterization of in-chip error correction circuits and related semiconductor memory devices/memory systems

A semiconductor memory device includes an error correction code (ECC) engine, a memory cell array, an input/output (I/O) gating circuit and a control logic circuit. The memory cell array includes a normal cell region configured to store main data and a parity cell region configured to selectively store parity data which the ECC engine generates based on the main data, and sub data received from outside of the semiconductor memory device. The control logic circuit controls the ECC engine to selectively perform an ECC encoding and an ECC decoding on the main data and controls the I/O gating circuit to store the sub data in at least a portion of the parity cell region.

A semiconductor memory device includes a memory cell array, an error correction code (ECC) engine, an input/output (I/O) gating circuit, and a control logic circuit. The memory cell array includes a plurality of bank arrays, and each of the bank arrays includes dynamic memory cells. The control logic circuit generates a first control signal to control the I/O gating circuit and a second control signal to control the ECC engine, in response to an access address and a command. The control logic circuit controls the ECC engine to perform s-bit ECC encoding on a write data to be stored in a first page of at least one bank array, in response to a first command, and controls the ECC engine to perform t-bit ECC decoding on a first codeword read from the first page, in response to a second command.

Semiconductor memory devices, memory systems, and methods of operating the semiconductor memory devices

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Yongin-si, South Korea

Sang-Uhn Cha