Tencent Technology (shenzhen) Company Limited

Chinese Academy of Sciences

Tencent Technology Company Limited

Sainan Huai

Yu Zhou

Shengyu Zhang

Zhenxing Zhang

Wenlong Zhang

Yarui Zheng

Maochun Dai

Yicong Zheng

Zelong Yin

Chuhong Yang

Zhongping Zhao

Yongdan Huang

Xiu Gu

Shuoming An

Xiong Xu

Sunan Ding

Kanglin Xiong

Jiagui Feng

Xiao Chen

Biao Wu

This disclosure includes a method for fabricating an air bridge, an air bridge structure, and a superconducting quantum chip, and relates to the field of circuit structures. In some examples, a method for fabricating an air bridge includes forming an air bridge brace structure on a substrate, and forming, on the air bridge brace structure and the substrate, an air bridge material layer with one or more openings in the air bridge material layer that reveal the air bridge brace structure. The air bridge material layer with the one or more openings is formed based on a patterned photoresist layer with patterns corresponding to the one or more openings. The method further includes removing, based on the one or more openings in the air bridge material layer, the air bridge brace structure to obtain the air bridge having the one or more openings.

Method for fabricating air bridge, air bridge structure, and superconducting quantum chip

This application relates to a photoresist removal method, including: acquiring a target wafer, a photoresist being provided on a surface of the target wafer, a surface of a photoresist layer of the photoresist being plated with a metal overhead layer; immersing the target wafer in a first organic solvent at a first temperature in a water bath for a first duration; rinsing the target wafer with a new first organic solvent in response to an end of the first duration; performing, in the first organic solvent, ultrasonic cleaning on the rinsed target wafer for a second duration based on a target ultrasonic power; removing the residual first organic solvent on the surface of the target wafer in response to an end of the second duration; and drying the target wafer with the solvent removed by simultaneous centrifugal drying and gas purging to obtain the target wafer with the photoresist removed.

Photoresist removal method and photoresist removal system

This application discloses methods and devices for a quantum chip, a quantum processor and a quantum computer, and relates to the field of quantum technology. The quantum chip includes a bottom sheet and a top sheet; a qubit array disposed on the top sheet, the qubit array comprising a plurality of qubits distributed in an array structure of M rows by N columns, and M and N being both integers greater than 1; a reading cavity disposed on the bottom sheet, and the reading cavity being configured to acquire status information of a qubit in the qubit array; and the bottom sheet and the top sheet being electrically connected.

Quantum chip, quantum processor and quantum computer

A superconducting quantum hybrid system includes: a silicon carbide (SiC) epitaxial layer; and a superconducting qubit line, the superconducting qubit line corresponding to a superconducting qubit, where a designated region of the SiC epitaxial layer includes a nitrogen vacancy (NV) center, the NV center being formed by implanting nitrogen ions into the designated region of the SiC epitaxial layer, and where the superconducting qubit line is located on a surface of the SiC epitaxial layer, the superconducting qubit is coupled to a solid-state defect qubit, and the solid-state defect qubit is a qubit corresponding to the NV center in the designated region.

Superconducting quantum hybrid system, computer device, and quantum chip

A quantum circuit includes: a qubit, a resonant cavity, and a feeder, the resonant cavity being coupled to the qubit, and the feeder being coupled to the qubit. The feeder is configured to feed an initialization signal to the qubit, the initialization signal being a modulation signal used for causing a frequency of the qubit to generate a vibration. The vibration causes an equivalent state exchange to occur between the qubit and the resonant cavity, and an excited state of the qubit is initialized to a ground state by using the resonant cavity.

Quantum circuit and quantum processor

A parity checking method and apparatus for a qubit, a superconducting quantum chip, an electronic device, and a storage medium are provided. The method includes: configuring a measurement system for a qubit excited state measurement environment, the measurement system including: a first data qubit, a second data qubit, and an auxiliary qubit; determining a first operational frequency parameter of the first data qubit; determining a second operational frequency parameter of the second data qubit; determining a third operational frequency parameter of the auxiliary qubit; determining a logic gate matching the qubit excited state measurement environment based on the first operational frequency parameter, the second operational frequency parameter, and the third operational frequency parameter; and checking parity of a qubit in the qubit excited state measurement environment according to the logic gate.

Parity checking method for qubit and superconducting quantum chip

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Shenzhen, China

Sainan Huai