Mec Company Ltd.

Sachiko Nakamura

Toshiko Nakagawa

Yoshiro Maki

Takashi Haruta

Yoshiaki Furukawa

Maki Yamanami

Minoru Outani

Terukazu Ishida

Etsuji Kameda

Yoshinari Miyata

Miho Misumi

Yoshihiro Kurii

The present invention relates to a resin surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds. The surface treating method of the present invention is a method of bringing a surface of a resin into contact with a surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds, and thereafter treating the surface with an acidic aqueous solution. This activates the resin surface and thereby increases a strength of adhesion of, for instance, a polyimide-based resin film with metal wires, as well as a strength of adhesion of a polyimide-based resin film with another resin. Thus, a resin surface treating agent that provides excellent productivity and reduces processing costs, as well as a surface treating method using the same, are provided.

Resin surface treating agent and resin surface treatment

A micro-etching composition and a printed circuit board fabricated by using the micro-etching composition are provided. The micro-etching composition, comprising a main ingredient consisting of sulfuric acid and hydrogen peroxide and an assisting ingredient consisting of phenyltetrazole and a chloride ion source, can continuously treat the surface of copper and copper alloys to produce fine microscopic pits for improved adhesion to resins without producing a brown or black deposit. The printed circuit board exhibits excellent adhesion between inner layer circuit patterns and insulation resin layers, and is free from haloing.

Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board

A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.

Composition for treating copper and copper alloy surfaces and method for

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Amagasaki, Japan

Sachiko Nakamura