Tokyo Electron Limited

Tokyo Electron Limi Ted

Ryuto Ozasa

Yasushi Takiguchi

Akihiro Kubo

Yoshiki Okamoto

Hayato Hosaka

Taro Yamamoto

Teruhiko Kodama

Shinsuke Kimura

Yuji Ariuchi

A dressing apparatusincludes a bus memberwhich is equipped with a ceiling plateand a circular or polygonal cylindrical skirt portionprovided at a bottom surface of the ceiling plateand which is configured to accommodate a polishing padfrom thereabove. The bus memberincludes a dual fluid nozzleconfigured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad; a dress boardconfigured to come into contact with the polishing surface of the polishing pad; and a rinse nozzleconfigured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing padand the dress board. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion

Dressing apparatus and dressing method for substrate rear surface polishing member

A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.

Substrate processing apparatus, substrate processing method and storage medium

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Koshi, Japan

Ryuto Ozasa