Hitachi, Ltd.

Hitachi-High-Technologies Corporation

Hitachi-Science Systems, Ltd.

Ryuichi Funatsu

Taku Ninomiya

Akira Inagaki

Yasuhiko Nara

Hiroshi Miyai

Hiroshi Makino

Hiroya Ohta

Masataka Shiba

Yukio Kembo

Sayaka Tanimoto

Motoya Taniguchi

Kenchi Ito

Asahiro Kuni

Yasuo Hira

Kazumi Kawamoto

Hidemi Sato

Atsuko Fukushima

Mari Nozoe

Minoru Ikeda

Yoshitada Oshida

Shigeto Isakozawa

Hidemi Koike

Yasuhiro Gunji

Koji Suzuki

Tsutomu Tanaka

Yasuhiko Nakayama

Kouichi Kurosawa

Hiroshi Asao

Naoto Nakashima

Keiichi Okamoto

Yoshihiro Komeyama

Yoshikazu Inada

Takehiko Konno

Masanari Furiki

Kenjirou Yamamoto

A charged particle beam apparatus that can achieve both high defect-detection sensitivity and high inspection speed for a sample with various properties in a multi-beam type semiconductor inspection apparatus. The allocation of the primary beam on the sample is made changeable, and furthermore, the beam allocation for performing the inspection at the optimum inspection specifications and at high speed is selected based on the property of the sample. In addition, many optical parameters and apparatus parameters are optimized. Furthermore, the properties of the selected primary beam are measured and adjusted.

Charged particle beam apparatus

A plurality of primary beams are formed from a single electron source, the surface charge of a sample is controlled by at least one primary beam, and at the same time, the inspection of the sample is conducted using a primary beam other than this. Also, for an exposure area of the primary beam for surface charge control and an exposure area of the primary beam for the inspection, the surface electric field strength is set individually. Also, the current of the primary beam for surface charge control and the interval between the primary beam for surface charge control and the primary beam for inspection are controlled.

Electron beam apparatus

An inspection method and apparatus irradiates a sample on which a pattern is formed with an electron beam, so that an inspection image and a reference image can be generated on the basis of a secondary electron or a reflected electron emitted by the sample. An abnormal pattern is determined based on a difference in halftone values of each pixel between the inspection image and the reference image. A plurality of feature quantities of the abnormal pattern are obtained from an image of the abnormal pattern, and, based on the distribution of the plurality of feature quantities of the abnormal pattern, a range for classifying the type of the abnormal pattern is designated. Thus, a desired defect can be extracted from many defects extracted by inspection.

Inspection method and apparatus using an electron beam

An inspection method and an inspection apparatus using an electron beam enabling more detailed and quantitative evaluation at a high throughput level. The method comprises the steps of irradiating, based on previously prepared information concerning a defect position on the surface of a sample, the defect and its vicinity with an electron beam a plurality of times at predetermined intervals; detecting an electron signal secondarily generated from the sample surface by the electron beam; imaging an electron signal detected by the previously specified n-th or later electron beam irradiation; and measuring the resistance or a leakage amount of the defective portion of the sample surface in accordance with the degree of charge relaxation by monitoring the charge relaxation state of the sample surface based on the electron beam image information.

Inspection method and inspection apparatus using electron beam

The object of the present invention is to transmit the position information of a defect that has been specified by means of a circuit pattern inspection apparatus quickly and precisely so that the position information is efficiently used in another apparatus. Marking is carried out on the peripheral area of the defect by use of a charged particle beam irradiation mechanism of the inspection apparatus. The marking realizes sharing of the defect position information with another apparatus. The marking technique includes deposition of a deposit and charging up by means of irradiation of a charged particle beam. The marking in the inspection apparatus allows the defect position information to be transmitted to another apparatus more correctly and easily, and as a result, analysis accuracy is improved and analysis time is shortened.

A circuit pattern inspection method and apparatus capable of readily setting an optimum threshold value while it is confirmed that a defect detected when a defect is checked can be detected at what threshold value and capable of forming a recipe easily. A circuit pattern inspection of irradiating an electron beam to a specimen formed with a circuit pattern on a surface thereof, forming an inspection image and a reference image in accordance with a secondary electron of a reflected electron from the specimen, and acquiring an abnormal portion from a difference between the inspection image and the reference image, wherein a plurality of characteristic quantities of the abnormal portion are obtained from an image of the abnormal portion, and the abnormal portion is selectively displayed by changing an inspection threshold value virtually set for the characteristic quantities.

Circuit pattern inspection method and its apparatus

The present invention is intended to detect defects in a circuit pattern formed on a semiconductor wafer by a circuit pattern forming process, to facilitates the extraction and observation of the defects, to improve the accuracy of analysis of the causes of the defects, and to determine the causes of the defects and to take measures to eliminate the causes of the defects in a greatly reduced time after the formation of the defects. A method of inspecting a circuit pattern for defects and analyzing defects, comprising locating a defect in a circuit pattern formed on a wafer by using an electron beam, specifying a chip having the defect on the basis of position data on the defect, cutting out the chip from the semiconductor wafer, thinning a portion of the chip to form a thin portion, and observing the thin portion of the chip under a transmission electron microscope to determine the causes of the defect.

Inspection of circuit patterns for defects and analysis of defects using a charged particle beam

Using an optical pickup, recording/reproducing of information is performed by irradiating light beams to an optical recording medium to form light spots. The optical pickup includes means for generating plural light beams, an optical waveguide for guiding the plural light beams in a row into a flat space, and a light deflecting element for deflecting the light beams, which run in the optical waveguide, within a plane formed by a vector perpendicular to a plane of the optical waveguide and a directional vector of the light beams. The light deflecting element deflects the plural light spots, which are to be arranged in a row, in a direction perpendicular to the light spot row to perform micro seek.

Optical information processing apparatus and optical pickup therefor

A beam control method and apparatus for processing a specimen. A specimen is irradiated with a first beam capable of modifying a property of the specimen. Subsequently, a second beam, incapable of modifying a property of the specimen, irradiates the trace formed by the first beam to thereby identify the actual position of the trace by detecting a signal representing the actual position of the trace. On the basis of comparing actual position of the trace with a desired position of the trace, the latter is controlled.

Beam control method and apparatus

A sample is located so as to be close to a prism and a light beam coming from a light source is projected to the prism while varying the incident angle to the prism as a parameter. The incident light beam to the prism is propagated therein and light emerging from the bottom surface of the prism, which is in contact with the sample, is projected to the sample. At the same time the intensity of light reflected by the bottom surface of the prism is measured. Optical constants such as the refractive index, the film thickness, the distribution of the refractive index, etc. are obtained by calculation, starting from measured values thus obtained.

Method and apparatus for measuring optical constants of a thin film as

Disclosed is an information detecting system of scanning type which comprises a substrate formed with an optical waveguide layer, a laser oscillator emitting a laser beam, a SAW type beam deflecting device formed on the optical waveguide layer, a beam irradiating section irradiating a specimen with the laser beam derived from the optical waveguide layer, a controller controlling the frequency of a high-frequency voltage applied to the SAW type beam deflecting device so as to scan the specimen with the laser beam directed from the beam irradiating section, and a detecting section detecting the position and/or the intensity of the laser beam scanning the specimen with respect to the SAW control signal controlled by the controller.

Information detecting system of scanning type

An enlargement projection type exposure method includes the steps of deforming the shape of a substrate so as to eliminate distortion in an enlarged image of the pattern, which is formed on a mask and projected onto the substrate through an enlargement projection system. The pattern is exposed with the use of an enlargement projection optical system. An apparatus for the method comprises an enlargement projection optical system for enlarging the pattern formed on the mask, and a substrate deforming device for deforming by adsorption the substrate in shape so as to eliminate the distortion in the enlarged image of the pattern through the enlargement projection optical system.

Exposure method and apparatus

Growing community of inventors

Hitachinaka, Japan

Ryuichi Funatsu