Tokyo Electron Limited

Ryoji Ikebe

Yoshifumi Amano

Satoshi Morita

Isamu Miyamoto

Norihisa Koga

Yasuaki Noda

Yuki Ito

Masato Hosaka

Eiichiro Okamoto

Keisuke Hamamoto

Kazuya Iwanaga

A measurement processing process Sof measuring a cut width of a film based on an image obtained by imaging, with an imaging unit, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process Sof creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S(S) of analyzing a state of the processed substrate based on the created management list; and a notification process S(S, S) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

Substrate processing system

Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process Sof acquiring information upon the kind of the film of the substrate; a selection process Sof selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process Sof controlling an imaging unitto image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.

Substrate processing apparatus, control method of substrate processing apparatus and substrate processing system

Disclosed is a measurement processing device including: a processing unit configured to control an imaging device to image a substrate, on which a processing film is removed from the peripheral edge portion, and an enclosure member that surrounds the substrate. A captured image obtained by the imaging device is processed to measure a cut width in which the processing film is absent in the peripheral edge portion of the substrate, and a gap width between a peripheral edge end of the substrate and the enclosure member.

Measurement processing device, substrate processing system, measurement jig, measurement processing method, and storage medium

A substrate processing apparatus includes carry in/out station, transfer station, processing station, and image capturing unit. The carry in/out station includes first conveyance device that takes out and conveys substrate from cassette. The transfer station is disposed adjacent to the carry in/out station, and includes substrate placement unit on which the substrate conveyed by the first conveyance device is placed. The processing station is disposed adjacent to the transfer station, and includes second conveyance device that takes out and conveys the substrate from the substrate placement unit, and a plurality of processing units that processes the substrate conveyed by the second conveyance device. The image capturing unit is disposed in the transfer station, and captures an image of the peripheral edge portion of one of the upper and lower surfaces of the substrate and the end surface of the substrate.

Substrate processing apparatus

Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatuswhich performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unitconfigured to hold and rotate the substrate; a first processing liquid supply unitA configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction Rby the rotating/holding unit; and an imaging unitprovided at a position in front of an arrival regionof the first processing liquid on the substrate with respect to the first rotational direction R, and configured to image the peripheral portion of the substrate.

Growing community of inventors

Koshi, Japan

Ryoji Ikebe