Dai Nippon Printing Co., Ltd.

Ryohei Kasai

Yuichi Yamamoto

Masaya Tanaka

Teppei Sotoda

Tadashi Furukawa

Ayako Furuse

Tsuyoshi Tsunoda

Shuji Sagara

Ryo Furugen

Tetsushi Hosoda

A mold includes a mold base material and a rugged structure located at a main surface of the mold base material. The rugged structure includes a plurality of linearly shaped projected portions for forming wiring, and a circularly shaped projected portion for forming a pad portion, in which a light-shielding layer is provided at a top portion flat surface of the circularly shaped projected portion for forming the pad portion.

Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board

Disclosed is a wiring substrate including: a first wiring layer, a second wiring layer disposed on the first wiring layer interposed by an insulating film, and a via conductor passing through the insulating film in a thickness direction, the via conductor electrically connecting the first wiring layer and the second wiring layer. The second wiring layer and the via conductor include a second sintered metal layer and a first sintered metal layer arranged to surround the second sintered metal layer, and an average particle diameter of first metal particles forming the first sintered metal layer is smaller than an average particle diameter of second metal particles forming the second sintered metal layer.

Mounting component and electronic device

Mounting component, wiring substrate, electronic device and manufacturing method thereof

Growing community of inventors

Tokyo, Japan

Ryohei Kasai