Advanced Micro-fabrication Equipment, Inc. Asia

Advanced Micro-fabrication Equipment, Inc.

Ruoxin Du

Tuqiang Q Ni

Ye Wy Wang

Jinyuan Chen

Sheng Guo

Tuqiang Ni

Xiang Sun

Xingjian Chen

Kuan Yang

Guangwei Fan

Hongqing Wang

Liang Ouyang

Disclosed is a plasma treatment apparatus, a lower electrode assembly and a forming method thereof, wherein the lower electrode assembly includes: a base for carrying a substrate to be treated; a focus ring encircling a periphery of the base; a coupling loop disposed below the focus ring; a conductive layer disposed in the coupling loop; and a wire for electrically connecting the conductive layer and the base so that the base and the conducting layer are equipotential. The lower electrode assembly is less prone to cause arc discharge.

Plasma treatment apparatus, lower electrode assembly and forming method thereof

Systems and methods for removing residual charge from a processed wafer are described. Removal of residual charge eliminates de-chucking failure that may break or damage the wafer. Residual charge is removed by applying a reverse polarity discharging DC voltage to an electrode embedded in an electrostatic chuck (ESC) supporting the wafer, and providing an outlet to the residual charge to ground via a lift pin assembly. Lift pin assembly is kept at the same potential with respect to a pedestal of the ESC to avoid sparking during the application of RF power to generate plasma. A residual charge sensor is included to sense and measure the amount of residual charge, so that the parameters of the reverse polarity discharging voltage can be adjusted in a subsequent de-chucking operation.

System and method of sensing and removing residual charge from a processed wafer

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Shanghai, China

Ruoxin Du