Merck Patent Gesellschaft MIT Beschrankter Haftung

Ciba-geigy Corporation

Merck Patent Gesellschaft MIT Beschraenkter Haftung

Rudolf Klug

Hartmut Hartner

Hans J Merrem

Hans-Joachim Merrem

Ekkehard Bartmann

Rochus Jonas

Horst Binder

Reinhard Schulz

Karl H Neisius

Thomas Herold

Karlheinz Neisius

The invention relates to negative photoresists of the polyimide type essentially containing, in an organic solvent, in each case at least

Negative photoresists of the polyimide type containing 1,2-disulfones

Stabilized solutions of radiation-crosslinkable polymer precursors of highly heat-resistant polymers, containing chelate complex-formers as stabilizers, do not tend to gel through premature crosslinking and can thus be stored and used over a long period.

Stabilized solutions of radiation-crosslinkable polymer precursors of

Photoresist formulations for forming relief structures from highly heat-resistant polyimide polymers, containing in an organic solvent in essence at least

Polyamide ester photoresist formulations of enhanced sensitivity

Photoresists suitable for use for forming relief structures of highly heat-resistant polymers and which contain soluble polymeric precursors which carry radiation-reactive radicals bonded through carboxylic ester groups have an increased light-sensitivity when they also contain at least one radiation-reactive, polymerizable allyl compound which has a boiling point above 180.degree., the allyl group thereof being bonded via an oxygen, sulfur and/or nitrogen atom. The highly heat-resistant polymers which can be prepared by means of these photoresists have excellent chemical, electrical and mechanical properties.

Photoresists suitable for forming relief structures of highly

An improved development process for relief structures based on radiation-crosslinked polymeric precursors of polymers which are resistant to high temperature in which the development fluid used is an aliphatic or cycloaliphatic ketone having 3 to 7 carbon atoms, is distinguished by rapid and complete removal of soluble polymeric material from the substrate with, at the same time, a minimum amount of attack on the radiation-crosslinked polymeric structures.

Process for the development of relief structures based on

Novel indoline derivatives of the formula ##STR1## wherein R is H or CH.sub.3 O and the X each are Cl or Br or collectively are --N(CH.sub.2 C.sub.6 H.sub.5)-- or acid addition salts thereof are obtained by treating a 3-hydroxy-1,2,3,4-tetrahydroquinoline of the formula ##STR2## with an inorganic acid halide and, if appropriate, the reacting resulting dihalogen compound with benzylamine or converting a resulting acid addition salt by treatment with a base in the free base or converting a free base by treatment with an acid to an acid addition salt.

Growing community of inventors

Aschaffenburg, Germany

Rudolf Klug